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Search Results - Calata, Jesus Noel
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Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area (100~^) Chips
by
Lei, Thomas Guangyin
,
Calata, Jesus Noel
,
Lu, Guo-Quan
,
Chen, Xu
,
Luo, Shufang
Published in
IEEE transactions on components and packaging technologies
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Strategies for improving the reliability of solder joints on power semiconductor devices
by
Lu, Guo-Quan
,
Liu, Xingsheng
,
Wen, Sihua
,
Noel Calata, Jesus
,
Bai, John G
Published in
Soldering & surface mount technology
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Constrained-film sintering of cordierite glass-ceramic on silicon substrate
by
Calata, Jesus Noel
,
Matthys, Allen
,
Lu, Guo-Quan
Published in
Journal of materials research
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Interface structure in graphite-fiber-reinforced metal-matrix composites
by
Rawal, Suraj P.
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Surface and interface analysis
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Constrained sintering of glass, glass-ceramic and ceramic coatings on metal substrates
by
Calata, Jesus Noel
,
Lu, Guo-Quan
,
Chuang, Tze-Jer
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Surface and interface analysis
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Adhesion strength of cordierite glass-ceramic coatings on molybdenum substrates
by
Lu, Guo-Quan
,
Calata, Jesus Noel
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Journal of materials research
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Determination of shear viscosity of borosilicate glass + silica powder compacts by an optical system
by
Bang, Jaecheol
,
Lu, Guo-Quan
,
Calata, Jesus Noel
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Journal of materials research
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Constrained sintering of glass, glass-ceramic and ceramic coatings on metal substrates: Surfaces and interfaces in materials
by
CALATA, Jesus Noel
,
LU, Guo-Quan
,
CHUANG, Tze-Jer
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Surface and interface analysis
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A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging
by
Guo-Quan Lu
,
Calata, J.N.
,
Zhiye Zhang
,
Bai, J.G.
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Conference Proceeding
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Comparison of the interfacial thermal resistivity of silver and solder die-attach using laser flash technique
by
Zhiye Zhang
,
Calata, J.N.
,
Suchicital, C.
,
Guo-Quan Lu
,
Hasselman, D.P.H.
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Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate
by
Guangyin Lei, T.
,
Calata, J.N.
,
Ngo, K.D.T.
,
Guo-Quan Lu
Published in
IEEE transactions on device and materials reliability
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