Search Results - Chan, Mu Hsuan

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  1. 1
    Characterization of N-doped TiO2 films prepared by reactive sputtering using air/Ar mixtures

    Characterization of N-doped TiO2 films prepared by reactive sputtering using air/Ar mixtures by Chan, Mu-Hsuan, Lu, Fu-Hsing

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  2. 2
    Preparation of titanium oxynitride thin films by reactive sputtering using air/Ar mixtures

    Preparation of titanium oxynitride thin films by reactive sputtering using air/Ar mixtures by Chan, Mu-Hsuan, Lu, Fu-Hsing

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  3. 3
    Preparation of ZrNxOy films by magnetron sputtering using air as a reactive gas

    Preparation of ZrNxOy films by magnetron sputtering using air as a reactive gas by CHAN, Mu-Hsuan, WU, Po-Lun, LU, Fu-Hsing

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  4. 4
    Air-Based Deposition of Conductive Nitride Thin Films by Sputtering

    Air-Based Deposition of Conductive Nitride Thin Films by Sputtering by Chan, Mu-Hsuan, Lu, Fu-Hsing

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  5. 5
    Characterization of Cr-doped TiO2 thin films prepared by cathodic arc plasma deposition

    Characterization of Cr-doped TiO2 thin films prepared by cathodic arc plasma deposition by CHAN, Mu-Hsuan, HO, Wei-Yu, WANG, Da-Yung, LU, Fu-Hsing

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  6. 6
    X-ray photoelectron spectroscopy analyses of titanium oxynitride films prepared by magnetron sputtering using air/Ar mixtures

    X-ray photoelectron spectroscopy analyses of titanium oxynitride films prepared by magnetron sputtering using air/Ar mixtures by Chan, Mu-Hsuan, Lu, Fu-Hsing

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  7. 7
    Air-based deposition and processing windows of sputtered TiN, TiNxOy, and N-doped TiOx thin films

    Air-based deposition and processing windows of sputtered TiN, TiNxOy, and N-doped TiOx thin films by Chan, Mu-Hsuan, Lu, Fu-Hsing

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  8. 8
    Influences of oxygen impurity contained in nitrogen on the reaction of titanium with nitrogen

    Influences of oxygen impurity contained in nitrogen on the reaction of titanium with nitrogen by Lu, Fu-Hsing, Jiang, Bor-Feng, Lo, Jen-Li, Chan, Mu-Hsuan

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  9. 9
    Characteristics of chromium-doped titanium oxide coatings synthesized by cathodic arc deposition

    Characteristics of chromium-doped titanium oxide coatings synthesized by cathodic arc deposition by Ho, Wei-Yu, Chan, Mu-Hsuan, Yao, Kao-Shan, Chang, Chi-Lung, Wang, Da-Yung, Hsu, Cheng-Hsun

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  10. 10
    Effects of cleaning process on the reliability of ultra-fine gap for 3D package

    Effects of cleaning process on the reliability of ultra-fine gap for 3D package by Mu-Hsuan Chan, Hsue, Brock, Chun-Tang Lin, Chiu, Steve, Yu-Po Wang

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  11. 11
    3DIC Stacking Process Investigation by Soldering Bonding Technology

    3DIC Stacking Process Investigation by Soldering Bonding Technology by Li, Jay, Jhen Chen, Wei, Lin, Joe, Hsuan Chan, Mu, Lo, Tank, Xu, Bruce, Yih Hung, Liang, Kao, Nicholas, Son Jiang, Don, Wang, Yu-Po

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  12. 12
    Underfill adhesion enhancement via optimization of plasma treatment for 3DIC

    Underfill adhesion enhancement via optimization of plasma treatment for 3DIC by Chi-Tung Yeh, Huei-Nuan Huang, Pai-Yuan Lee, Mu-Hsuan Chan, Lin, G. T., Chiu, Steve

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  13. 13
    Heat-resistance study of thermal release tape

    Heat-resistance study of thermal release tape by Chieh-Yuan Chi, Chun-Tang Lin, Jung-Pang Huang, Mu-Hsuan Chan, Yan-Yi Liao, Yan-Heng Chen, Wei-Yu Chen

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  14. 14
    Thermal cycling effect on intermetallic formation with various surface finish of micro bump interconnect for 3D package

    Thermal cycling effect on intermetallic formation with various surface finish of micro bump interconnect for 3D package by Mu-Hsuan Chan, Yi-Chian Liao, Chun-Tang Lin, Kuan-Weir Chuang, Huei-Nuan Huang, Chi-Tung Yeh, Wen-Tsung Tseng, Jeng-Yuan Lai

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  15. 15
    Effective 3DIC chip module warpage with UF design by analytical method

    Effective 3DIC chip module warpage with UF design by analytical method by Pai-Yuan Lee, Chi-Tung Yeh, Huei-Nuan Huang, Mu-Hsuan Chan, Chun-Tang Lin, Chiu, Steve, Ma, Mike

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  16. 16
    High thermal conductivity underfill study for fine pitch Cu pillar bump

    High thermal conductivity underfill study for fine pitch Cu pillar bump by Huei-Nuan Huang, Mei-Chin Lee, Chi-Tung Yeh, Pai-Yuan Lee, Mu-Hsuan Chan, Chun-Tang Lin, Chiu, Steve, Ma, Mike

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  17. 17
    Preparation of ZrN x O y films by magnetron sputtering using air as a reactive gas

    Preparation of ZrN x O y films by magnetron sputtering using air as a reactive gas by Chan, Mu-Hsuan, Wu, Po-Lun, Lu, Fu-Hsing

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  18. 18
    Characterization of N-doped TiO2 films prepared by reactive sputtering using air/Ar mixtures

    Characterization of N-doped TiO2 films prepared by reactive sputtering using air/Ar mixtures by CHAN, Mu-Hsuan, LU, Fu-Hsing

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  19. 19
    A study on the 3DIC interconnection using thermal compression bond with non conductive paste process

    A study on the 3DIC interconnection using thermal compression bond with non conductive paste process by Mu-Hsuan Chan, Huei-Nuan Huang, Chien-Feng Chan, Chun-Tang Lin, Yang, M-H, Jeng Yuan Lai

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  20. 20
    Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections

    Development of thermal compression bonding with Non Conductive Paste for 3DIC fine pitch copper pillar bump interconnections by Chien-Feng Chan, Wen-Tsung Tseng, Huei-Nuan Huang, Pin Huang, Mu-Hsuan Chan, Chun-Tang Lin, Liu, M., Chi-Hsin Chiu, Chiu, S., Ma, M.

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