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Study of Small Polyimide Open Size in Contact Resistance and Reliability For Flip Chip Cu Pillar Package
by
Kuo Frank, Kuei Hsiao
,
Xiao, Shaun
,
Hwang, Abram
,
Chang, Kui
,
Chang, Jovi
,
Chien, Feng Lung
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Enhanced Design and Reliability Analysis of Copper Post Wafer Level Package
by
Kuei Hsiao Kuo
,
Chen, Austin
,
Yen Neng Wang
,
Jiunn Jie Wang
,
Chang, Jovi
,
Feng Lung Chien
,
Lee, Rick
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Investigation of modified adzuki bean flavored milk formulations with hydrocolloids to improve sedimentation and overall quality
by
Huang, Ping-Hsiu
,
Ou, Xin-Mei
,
Shih, Ming‐Kuei
,
Chen, Shin-Yu
,
Ciou, Jhih-Ying
,
Tung, Ta Chih Jovi
,
Chang, Wen-Chang
,
Hou, Chih-Yao
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Applied Food Research
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Applied Food Research
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Science & Technology
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Engineering
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Engineering, Electrical & Electronic
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Legged Locomotion
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Polyimides
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Board Level Reliability
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Carrageenan
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Chip Package Interaction
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Component
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Contact Resistance
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Copper Post Wafer Level Package
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Copper Shear Strength
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Curing
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Electronic Components
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Emulsion Gel
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Food Science & Technology
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High Temperature Cure Polyimide
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