Search Results - Chani, P.C.H.

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    A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on ubm related intermetallic compound growth properties

    A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on ubm related intermetallic compound growth properties by Sing-Feng Gong, Guo-Wei Xiao, Chani, P.C.H., Lee, R.S.W., Yuen, M.M.F.

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    Conference Proceeding
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