Curvature measurements to improve polymer integration in microelectronic devices by Vavrille, Benjamin, Vignoud, Lionel, Chapelon, Laurent-Luc, Estevez, Rafael

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Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach by Vavrille, Benjamin, Vignoud, Lionel, Chapelon, Laurent-Luc, Estevez, Rafael

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Impact of dielectric stack and interface adhesion on mechanical properties of porous ultra low- k by Vitiello, Julien, Fuchsmann, Arno, Chapelon, Laurent-Luc, Arnal, Vincent, Barbier, Daniel, Torres, Joaquin

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Moisture Diffusion in PECVD a‑SiO x N y :H and a‑SiO x :H Coated on Polymer Resins: A Neutron Reflectometry Study by Chevreux, Fabien, Letiche, Manon, Vorobiev, Alexey, Wolff, Max, Chapelon, Laurent-Luc

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Elastic and thermo-elastic characterizations of thin resin films using colored picosecond acoustics and spectroscopic ellipsometry by Devos, A., Chevreux, F., Licitra, C., Chargui, A., Chapelon, L.-L.

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Full characterization of Cu/Cu direct bonding for 3D integration by Taibi, Rachid, Di Cioccio, Léa, Chappaz, Cedrick, Chapelon, Laurent-Luc, Gueguen, Pierric, Dechamp, Jérome, Fortunier, Roland, Clavelier, Laurent

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An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling by Di Cioccio, L., Gueguen, P., Taibi, R., Signamarcheix, T., Bally, L., Vandroux, L., Zussy, M., Verrun, S., Dechamp, J., Leduc, P., Assous, M., Bouchu, D., de Crecy, F., Chapelon, L.-L., Clavelier, L.

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