Time-resolved fluorescence anisotropy studies of the cononsolvency of poly(N-isopropyl acrylamide) in mixtures of methanol and water by Chee, Choong Kooi, Hunt, Barry J, Rimmer, Stephen, Soutar, Ian, Swanson, Linda

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Manipulating the thermoresponsive behaviour of poly(N-isopropylacrylamide) 3. On the conformational behaviour of N-isopropylacrylamide graft copolymers by Chee, Choong-Kooi, Hunt, Barry J., Rimmer, Stephen, Rutkaite, Ramune, Soutar, Ian, Swanson, Linda

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Mechanical and Thermal Properties of Polymer Composites for Electronic Packaging Application by Erfan Suryani Abdul Rashid, Ariffin, Kamarshah, Akil, Hazizan Md, Chee Choong Kooi

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Thermal Solutions For Large Die and Package by Chee, Choong Kooi, Hsu, Sean, Patel, Janak, Bamido, Alaba

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Time-resolved fluorescence anisotropy studies of the interaction of N-isopropyl acrylamide based polymers with sodium dodecyl sulphate by Chee, Choong Kooi, Rimmer, Stephen, Soutar, Ian, Swanson, Linda

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Preparation and properties of POSS/epoxy composites for electronic packaging applications by Rashid, Erfan Suryani Abd, Ariffin, Kamarshah, Kooi, Chee Choong, Akil, Hazizan Md

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Time-resolved fluorescence anisotropy studies of the temperature-induced intramolecular conformational transition of poly( N-isopropylacrylamide) in dilute aqueous solution by Chee, Choong Kooi, Rimmer, Stephen, Soutar, Ian, Swanson, Linda

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Polyurethane-modified epoxy resin: cure and mechanical properties by Ong, S., Ismail, J., Bakar, M.A., Rahman, I.A., Sipaut, C.S., Choong Kooi Chee

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Effect of ion exchange treatment on the properties of muscovite filled epoxy composite by Rashid, Erfan Suryani Abdul, Rasyid, Mohd Fadli Ahmad, Akil, Hazizan Md, Ariffin, Kamarshah, Kooi, Chee Choong

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Application of coreless substrate to package on package architectures by Nickerson, R., Olmedo, R., Mortensen, R., Choong Kooi Chee, Goyal, S., Ai Ling Low, Gealer, C.

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Time-resolved fluorescence anisotropy measurements in the study of poly( N-isopropyl acrylamide)-based systems by Chee, Choong Kooi, Rimmer, Steve, Rutkaite, Ramune, Soutar, Ian, Swanson, Linda

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Success story of collaboration between Intel and Malaysian universities to establish and enhance teaching and research in Electronic Packaging by Chandran, Dennis Prem Kumar, Yeek Kooi Sow, Mohd Harizan, Mohd Hasri, Chee Choong Kooi, Teoh Teik Hoy, Chong Kim Foong

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The mechanical and thermal properties of alumina filled epoxy by Rashid, E.S.A., Akil, H., Ariffin, K., Chee Choong Kooi

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Nano silica dispersion in epoxy : the investigation of heat, milling speed and duration effect by Ong, Shereen, Ismail, J, Bakar, M Abu, Rahman, I A, Sipaut, C Stephen, Choong Kooi Chee

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Lead-free compatible underfill materials for flip chip applications by Choong Kooi Chee, Yoong Tatt Chin, Sterrett, T., Yi He, Sow, H.P., Manepali, R., Chandran, D.

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Underfilling flip chip packages with transfer molding technologies by Chee Choong Kooi, Chew Yin Yan, Rudge, V.A., Lim Szu Shing, Then, E.

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Lead-free molded underfill technology for exposed die flip chip packages assembled in a molded matrix array packages form by Choong Kooi Chee, Szu Shing Lim, Rudge, V.A., Periaman, S., Ai Lin Ong, Hwa Wei Chan, Then, E.

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Capillary underfill and mold encapsulation materials for exposed die flip chip molded matrix array package with thin substrate by Chee Choong Kooi, Lim Szu Shing, Periaman, S., Chui, J., Then, E., Ng Cheong Huat, Low Mun Fai

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Factors influencing healthcare providers' behaviours in deprescribing: a cross-sectional study by Chang, Chee Tao, Chan, Huan-Keat, Liew, Ewilly Jie Ying, Abu Hassan, Muhammad Radzi, Lee, Jason Choong Yin, Cheah, Wee Kooi, Lim, Xin Jie, Rajan, Philip, Teoh, Siew Li, Lee, Shaun Wen Huey

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Development of a Malaysian potentially inappropriate prescribing screening tool in older adults (MALPIP): a Delphi study by Chang, Chee Tao, Chan, Huan Keat, Cheah, Wee Kooi, Tan, Maw Pin, Ch'ng, Alan Swee Hock, Thiam, Chiann Ni, Abu Bakar, Nor Azlina, Yau, Weng Keong, Abu Hassan, Muhammad Radzi, Rajan, Philip, Tan, Kar Choon, Ambigapathy, Subashini, Vengadasalam, Paranthaman, Zaman Huri, Surina, Arvinder-Singh, H S, Thum, Chern Choong, Chung, Wai Mun, Ooi, Jun How, Sabki, Noor Hamizah, Lee, Hooi Peng, Mohd Shariff, Siti Mallissa, Azman, Muhammad Azuan, Teoh, Siew Li, Lee, Shaun Wen Huey

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