56 nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme by LOQUET, Yannick, MIGNOT, Yann, MORRIS, Bryan, KLEEMEIER, Walter, LINIGER, E, SPOONER, Terry, WASKIEWICZ, Christopher, CHEN, James Hsueh-Chung, SANKARAPANDIAN, Muthumanickam, CHEN, Shyng-Tsong, FLAITZ, Philip, TOMIZAWA, Hideyuki, TSENG, Chia-Hsun, BEARD, Marcy

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A Study of Metal on Metal Multiple Patterning Scheme by Chen, James Hsueh-Chung, Silvestre, Mary-Claire, Ghosh, Somnath, Mignot, Yann, Kelly, James J., Clevenger, Lawrence A., Spooner, Terry A.

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Interconnect performance and scaling strategy at 7 nm node by Chen, James Hsueh-Chung, Standaert, Theodorus E., Alptekin, Emre, Spooner, Terry A., Paruchuri, Vamsi

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Middle of line RC performance study at the 7 nm node by Fan, Susan Su-Chen, Chen, James Hsueh-Chung, Kamineni, Vimal Kumar, Xunyuan Zhang, Raymond, Mark, Labelle, Cathy

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Interconnect performance and scaling strategy at the 5 nm Node by Chen, James Hsueh-Chung, LiCausi, Nicholas, Ryan, E. Todd, Standaert, Theodorus E., Bonilla, Griselda

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Strategy of Insertion of Merge Features in a Sea of Wires SADP Integration by Chen, James Hsueh-Chung, Spooner, Terry A., Clevenger, Lawrence A., O'Toole, Martin, Ogino, Atsushi, Lanzerotti, Louis, Reidy, Sean, Child, Craig

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Segment removal strategy in SAQP for advanced BEOL application by Chen, James Hsueh-Chung, Spooner, Terry A., Stephens, Jason E., O'Toole, Martin, LiCausi, Nicholas, Ben Kim, Narasimha, Shreesh, Child, Craig

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A Study on SADP Process Refresh for Patterning Correction by Chen, James Hsueh-Chung, Estrada-Raygoza, Isabel C, Peethale, Cornelius Brown, Mignot, Yann, Shobha, Hosadurga, Standaert, Theodorus E

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Planarity considerations in SADP for advanced BEOL patterning by Chen, James Hsueh-Chung, Spooner, Terry A., Stephens, Jason E., Law, Shao Beng, Beique, Genevieve, Kim, Ben, O'Toole, Martin, Lanzerotti, Louis, Leibiger, Steven, Ryan, E. Todd, Narasimha, Shreesh, Child, Craig

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Post porosity plasma protection integration at 48 nm pitch by Huai Huang, Lionti, Krystelle, Volksen, Willi, Spooner, Terry, Shobha, Hosadurga, Joe Lee, Chen, James Hsueh-Chung, Magbitang, Teddie, Peethala, Brown, Liniger, Eric G., Chao Kun Hu, Huang, Elbert, Canaperi, Donald F., Standaert, Theodorus E., Edelstein, Daniel C., Grill, Alfred, Dubois, Geraud, Bonilla, Griselda

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56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning scheme by Loquet, Yannick, Mignot, Yann, Waskiewicz, Christopher, Chen, James Hsueh-Chung, Sankarapandian, Muthumanickam, Chen, Shyng-Tsong, Flaitz, Philip, Tomizawa, Hideyuki, Tseng, Chia-Hsun, Beard, Marcy, Morris, Bryan, Kleemeier, Walter, Liniger, E., Spooner, Terry

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56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via by Chen, J. H.-C, Waskiewicz, C., Fan, S. S.-C, Halle, S., Chiew-seng Koay, Yongan Xu, Saulnier, N., Chia-Hsun Tseng, Yunpeng Yin, Mignot, Y., Beard, M., Morris, B., Horak, D., Mignot, S., Shobha, H., Sankarapandian, M., van der Straten, O., Kelly, J. J., Canaperi, D., Mclellan, E., Boye, C., Levin, T., Juntao Li, Demarest, J., Choi, S., Huang, E., Liemann, L., Haran, B., Arnold, J. C., Colburn, M., Clevenger, L., Spooner, T.

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Effects of Chinese herbal medicine in combination with mitomycin C on gastric cancer cells by Kuo, Che-Chang, Chen, Jian-Jung, Tsai, James Y, Hsueh, Chung-Tsen

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Efficient light upconversion via resonant exciton-exciton annihilation of dark excitons in few-layer transition metal dichalcogenides by Chen, Yi-Hsun, Ping-Yuan, Lo, Boschen, Kyle W, Guan-Hao, Peng, Chun-Jui Huang, Holtzman, Luke N, Hsu, Chih-En, Yung-Ning Hsu, Holbrook, Madisen, Wei-Hua, Wang, Barmak, Katayun, Hone, James, Hawrylak, Pawel, Hung-Chung Hsueh, Davis, Jeffrey A, Cheng, Shun-Jen, Fuhrer, Michael S, Shao-Yu, Chen

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