Entecavir add-on Peg-interferon therapy plays a positive role in reversing hepatic fibrosis in treatment-naïve chronic hepatitis B patients: a prospective and randomized controlled... by Yang, Jing-Mao, Chen, Li-Ping, Wang, Ya-Jie, Lyu, Bei, Zhao, Hong, Shang, Zhi-Yin, Li, Jun, Fan, Zhen-Yu, Wu, Sheng-Di, Ming, Xiao, Li, Xian, Huang, Shao-Ping, Cheng, Ji-Lin

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Longitudinal monitoring of liver fibrosis status by transient elastography in chronic hepatitis B patients during long-term entecavir treatment by Wu, Sheng-Di, Liu, Li-Li, Cheng, Ji-Lin, Liu, Yun, Cheng, Li-Sha, Wang, Si-Qi, Ma, Wei, Chen, Li-Ping, Tseng, Yu-Jen, Wang, Ji-Yao, Shen, Xi-Zhong, Jiang, Wei

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Design and analysis of wafer-level CSP with a double-pad structure by Lin, Ji-Cheng, Cheng, Hsien-Chie, Chiang, Kuo-Ning

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Reliability analysis and design for the fine-pitch flip chip BGA packaging by Peng, C.-T., Liu, C.-M., Lin, J.-C., Cheng, H.-C., Chiang, K.-N.

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Scheme for Realizing Probabilistic Teleportation of Bipartite Photonic States via Linear Optical Elements by Ping, Dong, Ji-Cheng, Lin, Ming, Yang, Zhuo-Liang, Cao

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Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology by Peng, Chih-Tang, Lin, Ji-Cheng, Lin, Chun-Te, Chiang, Kuo-Ning

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Hepatitis C virus in human B lymphocytes transformed by Epstein-Barr virus in vitro by in situ reverse transcriptase-polymerase chain reaction by Cheng, J L, Liu, B L, Zhang, Y, Tong, W B, Yan, Z, Feng, B F

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Analysis and validation of thermal and packaging effects of a piezoresistive pressure sensor by Peng, Chih-Tang, Lin, Ji-Cheng, Lin, Chun-Te, Chiang, Kuo-Ning

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A study of factors affecting solder joint fatigue life of thermally enhanced ball grid array assemblies by Cheng, Hsien-Chie, Chiang, Kuo-Ning, Chen, Chao-Kuang, Lin, Ji-Cheng

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Thermal/mechanical analysis of novel Ceramic-TSOP using nonlinear finite element method by Lin, Ji-Cheng, Chiang, Kuo-Ning

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Considerations of SiP based Antenna in Package/ Module (AiP/AiM) Design at Sub-Terahertz Frequencies for Potential B5G/6G Applications by Wu, Kuan-Hsun, Chou, Hsi-Tseng, Lin, Ding-Bing, Yang, Chao-Shun, Chou, Chieh-Wei, Pan, Chi-Liang, Lin, Chun-Te, Lin, Ji-Cheng, Fang, Li-Chih, Ivashina, Marianna

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5G Antenna in Module (AiM) Architecture to Realize a Large Active Antenna Array with Unequal Shortest Microstrip Paths to Minimize Feeding Loss by Using True-delay Line-based Phase... by Lin, Zhao-He, Chou, Hsi-Tseng, Shen, Pin-Zhong, Lin, Ding-Bing, Yang, Chao-Shun, Chou, Chieh-Wei, Pan, Chi-Liang, Lin, Chun-Te, Lin, Ji-Cheng, Fang, Li-Chih

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Sensitivity of Dielectric Substrate Property Discrepancy and Metal Microstrip Roughness to the Electronic Characteristics of Antenna-in-Packaging for 5G Applications at Millimeter-... by Wu, Kuan-Hsun, Lin, Zhao-He, Chou, Hsi-Tseng, Shen, Pin-Zhong, Lin, Ding-Bing, Yang, Chao-Shun, Chou, Chieh-Wei, Pan, Chi-Liang, Lin, Ji-Cheng, Fang, Li-Chih

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Active Antenna Subsystem Integration of Steerable Boresight Radiation Beams for 5G Millimeter Wave Applications by System-in-Packaging Process by Shen, Pin-Zhong, Lin, Ding-Bing, Lin, Zhao-He, Chou, Hsi-Tseng, Wu, Kuan-Hsun, Fang, Li-Chih, Yang, Chao-Shun, Chou, Chieh-Wei, Pan, Chi-Liang, Lin, Chun-Te, Lin, Ji-Cheng

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Expression changes of activin A in the development of hepatic fibrosis by Huang, X, Li, D G, Wang, Z R, Wei, H S, Cheng, J L, Zhan, Y T, Zhou, X, Xu, Q F, Li, X, Lu, H M

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One-dimensional Steerable End-fire Orthogonal Beams for 5G Millimeter Wave Applications by L-shape Antenna Element Arrangement in Antenna-in-Packaging Design by Wu, Kuan-Hsun, Lin, Zhao-He, Chou, Hsi-Tseng, Shen, Pin-Zhong, Lin, Ding-Bing, Fang, Li-Chih, Lin, Ji-Cheng, Yang, Chao-Shun, Chou, Chieh-Wei, Pan, Chi-Liang, Lin, Chun-Te

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Wavelet Neural Network Equalization Algorithm Based on Spatial Diversity by Guo, Ye-cai, Lin, Ji-cheng, Gao, Min, Zhao, Xue-qing

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Spectroscopic Leaf Level Detection of Powdery Mildew for Winter Wheat Using Continuous Wavelet Analysis by ZHANG, Jing-cheng, YUAN, Lin, WANG, Ji-hua, HUANG, Wen-jiang, CHEN, Li-ping, ZHANG, Dong-yan

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Thermal/mechanical analysis of novel C-TSOP using nonlinear FEM method by Ji-Cheng Lin, Kuo-Ning Chiang

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Development on ultra high density memory package with PoP structure by Ji Cheng Lin, Yu, J., Chung, B., Chang, K., Fang, D.

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