Search Results - Cheng, Ren-Shing

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    Through-Silicon Hole Interposers for 3-D IC Integration

    Through-Silicon Hole Interposers for 3-D IC Integration by Lau, John H., Lee, Ching-Kuan, Zhan, Chau-Jie, Wu, Sheng-Tsai, Chao, Yu-Lin, Dai, Ming-Ji, Tain, Ra-Min, Chien, Heng-Chieh, Hung, Jui-Feng, Chien, Chun-Hsien, Cheng, Ren-Shing, Huang, Yu-Wei, Cheng, Yu-Mei, Liao, Li-Ling, Lo, Wei-Chung, Kao, Ming-Jer

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