High-reliability, high-melting, lead-free, mixed solder paste System—BiAgX by Zhang, HongWen, Lee, Ning-Cheng

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A Brief Review on High-Temperature, Pb-Free Die-Attach Materials by Zhang, Hongwen, Minter, Jonathan, Lee, Ning-Cheng

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Mechanical Performance and Reliability of a Sn-Ag-Cu-Sb Alloy at Elevated Temperatures by Chen, Zhiwen, Ma, Kun, Liu, Li, Lee, Ning-Cheng, Liu, Guoyou, Yan, Jiasheng, Li, Hui, Liu, Sheng, Ruan, Meng, Pan, Huiming, Lu, Wenli, Ding, Jiaqi

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Editorial: Composite solder joints by Zhang, Shuye, He, Peng, Paik, Kyung-Wook, Suhir, Ephraim, Lee, Ning-Cheng

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A Brief Review on High-Temperature, Pb-Free Die-Attach Materials by Zhang, Hongwen, Minter, Jonathan, Lee, Ning-Cheng

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Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions by Zhang, Zhao, Liu, Sheng, Ma, Kun, Chen, Zhiwen, Qian, Zhengfang, Lee, Ning-Cheng

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Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging by Lau, John H., Ming Li, Dewen Tian, Fan, Nelson, Kuah, Eric, Wu Kai, Li, Margie, Hao, J., Yiu Ming Cheung, Zhang Li, Kim Hwee Tan, Beica, Rozalia, Taylor, Thomas, Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Sze Pei Lim, Ning Cheng Lee, Jiang Ran, Cao Xi, Koh Sau Wee, Qingxiang Yong

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Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints by Song, Jenn-Ming, Liu, Yao-Ren, Lai, Yi-Shao, Chiu, Ying-Ta, Lee, Ning-Cheng

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High performance thermal interface materials with enhanced reliability by Sihai Chen, Ning-Cheng Lee

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SIP Solder Paste via Powder Cluster Design Harvest Both Slump Resistance and Temperature Cycling Reliability by Xu, Zhengfeng, Wang, Jian, Lee, Ning-Cheng, Zheng, Aixia, Wang, Ming, Gu, Qiwei

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An RFID-Based Reminder System for Smart Home by Hui-Huang Hsu, Cheng-Ning Lee, Yu-Fan Chen

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Alloying modification of Sn–Ag–Cu solders by manganese and titanium by Lin, Li-Wei, Song, Jenn-Ming, Lai, Yi-Shao, Chiu, Ying-Ta, Lee, Ning-Cheng, Uan, Jun-Yen

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Optimizing the reflow profile via defect mechanism analysis by Lee, Ning-Cheng

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Effect of SnAgCu composition on soldering performance by Huang, Benlih, Dasgupta, Arnab, Lee, Ning-Cheng

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Assessment of solder paste technology limitation at miniaturization for SIP and SMT application by Keck, Joanna, Ning-Cheng Lee

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Nano-Cu sintering paste for high power devices die attach applications by Jinjin Zhao, Min Yao, Ning-Cheng Lee

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Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish by Arfaei, Babak, Mutuku, Francis, Sweatman, Keith, Ning-Cheng Lee, Cotts, Eric, Coyle, Richard

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Engineering solder paste performance through controlled stress rheology analysis by Bao, Xiaohua, Lee, Ning-Cheng, Raj, Rajkumar B, Rangan, K.P, Maria, Anu

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Nano-Cu Sintering Paste for High Power Devices Die Attach Applications by Zhao, Jinjin, Yao, Min, Lee, Ning-Cheng

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A Novel Lead-Free Low-Temperature Solder with Excellent Drop-Shock Re-sistance by Zhang, Hongwen, Lytwynec, Samuel, Lee, Ning-Cheng, Lim, Sze Pei

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