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Reliability concerns in copper TSV's: Methods and results
by
Croes, Kristof
,
Cherman, Vladimir O.
,
Li, Yunlong
,
Zhao, Larry
,
Barbarin, Yohan
,
De Messemaeker, Joke
,
Civale, Yann
,
Velenis, Dimitrios
,
Stucchi, Michele
,
Kauerauf, Thomas
,
Redolfi, Augusto
,
Dimcic, Biljana
,
Ivankovic, Andrej
,
Van der Plas, Geert
,
De Wolf, Ingrid
,
Beyer, Gerald
,
Swinnen, Bart
,
Tokei, Zsolt
,
Beyne, Eric
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Conference Proceedings
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Copper
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Engineering
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Engineering, Electrical & Electronic
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Reliability
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Science & Technology
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Silicon
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Stress
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Technology
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Thermal Stresses
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Through-Silicon Vias
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Transistors
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Ieee Electronic Library (Iel) Conference Proceedings
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