Overcoming Cu/CVD low-k integration challenges in a high performance interconnect technology by Lytle, S.A., Karthikeyan, S., Oladeji, I.O., Lee, T.J., Li, H.M., Zhang, A., Steiner, K.G., Merchant, S.M., Oh, M., Jessen, S.W., Gibson, G.W., Ramappa, D., Taylor, J.A., Tse, T.Y., Hariharaputhiran, M., Hua, G., Kim, H.T., Mattern, L.N., Kamat, N., Chew, P.K.H., Chesire, D.P., Kang, S.H., Vitkavage, S.C., Adebanjo, R.O., Wolf, T.M., Kook, T., Huang, R.Y.S., Cuthbertson, A., Hillenius, S.J., Ibbotson, D.E.

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