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Surface reaction during thermal atomic layer etching of aluminum oxide films using fluorine radicals and trimethylaluminum
by
Kim, Yewon
,
Kim, Okhyeon
,
Cho, Gyejun
,
Kim, Hye-Lee
,
Kim, Minsu
,
Cho, Byungchul
,
Park, Sangjoon
,
Jung, Jongwan
,
Lee, Won-Jun
Published in
Applied surface science
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Applied Surface Science
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Atomic Layer Etching
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Chemistry
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Chemistry, Physical
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Etch Process Temperature
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Fluorinated Layer
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Materials Science
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Materials Science, Coatings & Films
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Physical Sciences
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Physics
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Physics, Applied
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Physics, Condensed Matter
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Remote Plasma
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Science & Technology
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Surface Reaction
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