Thermal cycling analysis of flip-chip solder joint reliability by Pang, J.H.L., Chong, D.Y.R., Low, T.H.

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Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models by Pang, J.H.L., Chong, D.Y.R.

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Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array) by Chong, D.Y.R., Che, F.X., Pang, J.H.L., Luhua Xu, Xiong, B.S., Toh, H.J., Lim, B.K.

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Mechanical characterization in failure strength of silicon dice by Chong, D.Y.R., Lee, W.E., Lim, B.K., Pang, J.H.L., Low, T.H.

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Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis by Chong, D.Y.R., Kapoor, R., Sun, A.Y.S.

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Development of a new improved high performance flip chip BGA package by CHONG, Desmond Y. R, LIM, B. K, REBIBIS, Kenneth J, PAN, S. J, KRISHNAMOORTHI, S, KAPOOR, R, SUN, Anthony Y. S, TAN, H. B

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Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package by Chong, D.Y.R., Lim, B.K., Rebibis, K.J., Pan, S.J., Sivalingam, K., Kapoor, R., Sun, A.Y.S., Tan, H.B.

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Development of ball grid array packages with improved thermal performance by Ma, Y.Y., Chong, D.Y.R., Wang, C.K., Sun, A.Y.S.

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Thermal management and characterization of flip chip BGA packages by Krishnamoorthi, S., Chong, D.Y.R., Sun, A.Y.S.

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Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages by Chong, D.Y.R., Kellin Ng, Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Xu, L.H.

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Design and development of stacked die technology solutions for memory packages by Chong, D.Y.R., Liu, H., Lim, B.K., Win, P., Wang, C.K., Tan, H.B., Sun, A.Y.S.

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Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP) by Chong, D.Y.R., Toh, H.J., Lim, B.K., Low, P.T.H., Pang, J.H.L., Che, F.X., Xiong, B.S., Luhua Xu

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Performance assessment on board-level drop reliability for chip scale packages (fine-pitch BGA) by Chong, D.Y.R., Che, F.X., Xu, L.H., Toh, H.J., Pang, J.H.L., Xiong, B.K., Lim, B.K.

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Thermal characterization of a thermally enhanced QFN package by Krishnamoorthi, S., Goh, K.Y., Chong, D.Y.R., Kapoor, R., Sun, A.Y.S.

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Drop test reliability assessment of leaded & lead-free solder joints for IC packages by Chong, D.Y.R., Ng, K., Tan, J.Y.N., Low, P.T.H., Pang, J.H.L., Che, F.X.

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Improving the reliability of quad flat no-lead packages through test & structural optimization by Lim, B.K., Poh, F.K.S., Chong, D.Y.R., Koh, S.W.

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Reliability analyses for new improved high performance flip chip BGA packages by Chong, D.Y.R., Goh, K.Y., Kapoor, R., Sun, A.Y.S.

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Design and Development of True-CSP by Kanth, K.R., Poh, F.K.S., Lim, B.K., Chong, D.Y.R., Sun, A., Tan, H.B.

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Heat spreader impact on electrical performances of a 4-layer PBGA package by PAN, S. J, CHONG, Desmond Y. R, SUN, Anthony Y. S

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Mechanical failure strength characterization of silicon dice by Chong, D.Y.R., Lee, W.E., Pang, J.H.L., Low, T.H., Lim, B.K.

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