Search Results - Chou, Che-Wei
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A TSV Repair Scheme Using Enhanced Test Access Architecture for 3-D ICs
Conference Proceeding -
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Post-bond test techniques for TSVs with crosstalk faults in 3D ICs
Conference Proceeding -
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Isothermal section of ternary Sn-Zn-Ni phase equilibria at 250
Published in 自然科学进展(英文版)Get full text
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A low-cost built-in self-test scheme for an array of memories
Conference Proceeding -
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Test and Repair Scheduling for Built-In Self-Repair RAMs in SOCs
Conference Proceeding -
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Hierarchical Test Integration Methodology for 3-D ICs
Published in IEEE design and testGet full text
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