A comprehensive study of Monolithic 3D cell on cell design using commercial 2D tool by Billoint, O., Sarhan, H., Rayane, I., Vinet, M., Batude, P., Fenouillet-Beranger, C., Rozeau, O., Cibrario, G., Deprat, F., Fustier, A., Michallet, J-E, Faynot, O., Turkyilmaz, O., Christmann, J-F, Thuries, S., Clermidy, F.

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Low leakage and low variability Ultra-Thin Body and Buried Oxide (UT2B) SOI technology for 20nm low power CMOS and beyond by Andrieu, F, Weber, O, Mazurier, J, Thomas, O, Noel, J.-P, Fenouillet-Béranger, C, Mazellier, J.-P, Perreau, P, Poiroux, T, Morand, Y, Morel, T, Allegret, S, Loup, V, Barnola, S, Martin, F, Damlencourt, J.-F, Servin, I, Cassé, M, Garros, X, Rozeau, O, Jaud, M.-A, Cibrario, G, Cluzel, J, Toffoli, A, Allain, F, Kies, R, Lafond, D, Delaye, V, Tabone, C, Tosti, L, Brévard, L, Gaud, P, Paruchuri, V, Bourdelle, K K, Schwarzenbach, W, Bonnin, O, Nguyen, B.-Y, Doris, B, Bœuf, F, Skotnicki, T, Faynot, O

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Novel fine-grain back-bias assist techniques for 3D-monolithic 14 nm FDSOI top-tier SRAMs by Bosch, D., Garros, X., Makosiej, A., Ciampolini, L., Weber, O., Lacord, J., Cluzel, J., Giraud, B., Berthelon, R., Cibrario, G., Brunet, L., Batude, P., Fenouillet-Béranger, C., Lattard, D., Colinge, J.P., Balestra, F., Andrieu, F.

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Design Technology Co-Optimization in advanced FDSOI CMOS around the Minimum Energy Point: body biasing and within-cell VT-mixing by Andrieu, F., Pirro, L., Berthelon, R., Morgan, J., Cibrario, G., Wiatr, M., Hoentschel, J., Vinet, M.

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3DVLSI with CoolCube process: An alternative path to scaling by Batude, P., Fenouillet-Beranger, C., Pasini, L., Lu, V., Deprat, F., Brunet, L., Sklenard, B., Piegas-Luce, F., Casse, M., Mathieu, B., Billoint, O., Cibrario, G., Turkyilmaz, O., Sarhan, H., Thuries, S., Hutin, L., Sollier, S., Widiez, J., Hortemel, L., Tabone, C., Samson, M.-P, Previtali, B., Rambal, N., Ponthenier, F., Mazurier, J., Beneyton, R., Bidaud, M., Josse, E., Petitprez, E., Rozeau, O., Rivoire, M., Euvard-Colnat, C., Seignard, A., Fournel, F., Benaissa, L., Coudrain, P., Leduc, P., Hartmann, J.-M, Besson, P., Kerdiles, S., Bout, C., Nemouchi, F., Royer, A., Agraffeil, C., Ghibaudo, G., Signamarcheix, T., Haond, M., Clermidy, F., Faynot, O., Vinet, M.

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Planar Fully depleted SOI technology: A powerful architecture for the 20nm node and beyond by Faynot, O, Andrieu, F, Weber, O, Fenouillet-Béranger, C, Perreau, P, Mazurier, J, Benoist, T, Rozeau, O, Poiroux, T, Vinet, M, Grenouillet, L, Noel, J.-P, Posseme, N, Barnola, S, Martin, F, Lapeyre, C, Cassé, M, Garros, X, Jaud, M.-A, Thomas, O, Cibrario, G, Tosti, L, Brevard, L, Tabone, C, Gaud, P, Barraud, S, Ernst, T, Deleonibus, S

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Opportunities and challenges brought by 3D-sequential integration by Batude, P., Brunet, L., Fenouillet-Beranger, C., Lattard, D., Andrieu, F., Vinet, M., Brevard, L., Ribotta, M., Previtali, B., Tabone, C., Ponthenier, F., Rambal, N., Sideris, P., Garros, X., Casse, M., Theodorou, C., Sklenard, B., Lacord, J., Besson, P., Fournel, F., Kerdiles, S., Acosta-Alba, P., Mazzocchi, V., Hartmann, J-M., Mazen, F., Thuries, S., Billoint, O., Vivet, P., Sicard, G., Cibrario, G., Mouhdach, M., Giraud, B., Ribotta, CM, Lapras, V.

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Back-end limitations in advanced nodes and alternatives by Ayres, A., Rozeau, O., Borot, B., Fesquet, L., Cibrario, G., Vinet, M.

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Monolithic 3D integration: A powerful alternative to classical 2D scaling by Vinet, M., Batude, P., Fenouillet-Beranger, C., Clermidy, F., Brunet, L., Rozeau, O., Hartmannn, Jm, Billoint, O., Cibrario, G., Previtali, B., Tabone, C., Sklenard, B., Turkyilmaz, O., Ponthenier, F., Rambal, N., Samson, Mp, Deprat, F., Lu, V., Pasini, L., Thuries, S., Sarhan, H., Michallet, J.-E, Faynot, O.

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Back-bias impact on variability and BTI for 3D-monolithic 14nm FDSOI SRAMs applications by Bosch, D., Andrieu, F., Garros, X., Ciampolini, L., Makosiej, A., Weber, O., Lacord, J., Cluzel, J., Giraud, B., Cibrario, G., Brunet, L., Batude, P., Fenouillet-Beranger, C., Lattard, D., Colinge, J. P., Balestra, F., Vinet, M.

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Design technology co-optimization of 3D-monolithic standard cells and SRAM exploiting dynamic back-bias for ultra-low-voltage operation by Andrieu, F., Berthelon, R., Boumchedda, R., Tricaud, G., Brunet, L., Batude, P., Mathieu, B., Avelar, E., de Sousa, A. Ayres, Cibrario, G., Rozeau, O., Lacord, J., Billoint, O., Fenouillet-Beranger, C., Guissi, S., Fried, D., Morin, P., Noel, J. P., Giraud, B., Thuries, S., Arnaud, F., Vinet, M.

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Impact of intermediate BEOL technology on standard cell performances of 3D VLSI by Brocard, M., Berhault, G., Thuries, S., Clermidy, F., Batude, P., Fenouillet-Beranger, C., Brunet, L., Andrieu, F., Deprat, F., Lacord, J., Rozeau, O., Cibrario, G., Billoint, O.

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Towards ultra-dense arrays of VHF NEMS with FDSOI-CMOS active pixels for sensing applications by Arndt, G., Dupre, C., Arcamone, J., Cibrario, G., Rozeau, O., Duraffourg, L., Ollier, E., Colinet, E.

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Fundamental variability limits of filament-based RRAM by Grossi, A., Nowak, E., Zambelli, C., Pellissier, C., Bernasconi, S., Cibrario, G., El Hajjam, K., Crochemore, R., Nodin, J.F., Olivo, P., Perniola, L.

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3D sequential integration opportunities and technology optimization by Batude, P., Sklenard, B., Fenouillet-Beranger, C., Previtali, B., Tabone, C., Rozeau, O., Billoint, O., Turkyilmaz, O., Sarhan, H., Thuries, S., Cibrario, G., Brunet, L., Deprat, F., Michallet, J-E, Clermidy, F., Vinet, M.

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A 3D Process Design Kit generator based on customizable 3D layout design environment by Cibrario, G., Henry, D., Chantre, C., Cuchet, R., Berthelot, A., Azizi-Mourier, K., Gary, M., Gays, F.

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3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies by Coudrain, P., Henry, D., Berthelot, A., Charbonnier, J., Verrun, S., Franiatte, R., Bouzaida, N., Cibrario, G., Calmon, F., O'Connor, I., Lacrevaz, T., Fourneaud, L., Flechet, B., Chevrier, N., Farcy, A., Le-Briz, O.

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Ultra-scaled high-frequency single-crystal Si NEMS resonators and their front-end co-integration with CMOS for high sensitivity applications by Ollier, E., Dupre, C., Arndt, G., Arcamone, J., Vizioz, C., Duraffourg, L., Sage, E., Koumela, A., Hentz, S., Cibrario, G., Meininger, P., Benotmane, K., Marcoux, C., Rozeau, O., Billiot, G., Colinet, E., Andrieu, F., Philippe, J., Aussenac, F., Mercier, D., Blanc, H., Ernst, T., Robert, P.

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Probing Kepler’s hottest small planets via homogeneous search and analysis of optical secondary eclipses and phase variations by Singh, V, Bonomo, A S, Scandariato, G, Cibrario, N, Barbato, D, Fossati, L, Pagano, I, Sozzetti, A

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Incremental Fermi Large Area Telescope Fourth Source Catalog by Abdollahi, S., Acero, F., Baldini, L., Bastieri, D., Berenji, B., Berretta, A., Bissaldi, E., Bonino, R., Brill, A., Britto, R. J., Burnett, T. H., Cameron, R. A., Caputo, R., Caraveo, P. A., Chiaro, G., Cibrario, N., Ciprini, S., Coronado-Blázquez, J., D’Ammando, F., De Gaetano, S., Digel, S. W., Domínguez, A., Fegan, S. J., Fleischhack, H., Franckowiak, A., Galanti, G., Gargano, F., Garrappa, S., Gasparrini, D., Giacchino, F., Giglietto, N., Giordano, F., Giroletti, M., Glanzman, T., Grenier, I. A., Grondin, M.-H., Guiriec, S., Gustafsson, M., Hewitt, J. W., Horan, D., Hou, X., Karwin, C., Kayanoki, T., Kerr, M., Kuss, M., Landriu, D., Larsson, S., Latronico, L., Lemoine-Goumard, M., Li, J., Liodakis, I., Longo, F., Loparco, F., Lubrano, P., Maldera, S., Malyshev, D., Martí-Devesa, G., Mazziotta, M. N., Mereu, I., Meyer, M., Michelson, P. F., Mirabal, N., Mitthumsiri, W., Mizuno, T., Moiseev, A. A., Monzani, M. E., Morselli, A., Moskalenko, I. V., Negro, M., Nuss, E., Omodei, N., Orlando, E., Pei, Z., Perkins, J. S., Persic, M., Pesce-Rollins, M., Petrosian, V., Pillera, R., Rando, R., Reimer, A., Reimer, O., Reposeur, T., Sánchez-Conde, M., Saz Parkinson, P. M., Scotton, L., Serini, D., Sgrò, C., Siskind, E. J., Smith, D. A., Spandre, G., Spinelli, P., Sueoka, K., Suson, D. J., Tak, D., Thayer, J. B., Torres, D. F., Troja, E., Valverde, J., Wood, K., Zaharijas, G.

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