Search Results - Cirelli, Ray

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  1. 1
    Fabricating Complex Three-Dimensional Nanostructures with High-Resolution Conformable Phase Masks

    Fabricating Complex Three-Dimensional Nanostructures with High-Resolution Conformable Phase Masks by Jeon, Seokwoo, Park, Jang-Ung, Cirelli, Ray, Yang, Shu, Heitzman, Carla E., Braun, Paul V., Paul J. A. Kenis, Rogers, John A., Murray, Cherry A.

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  2. 2
    Transmission enhancement in an array of subwavelength slits in aluminum due to surface plasmon resonances

    Transmission enhancement in an array of subwavelength slits in aluminum due to surface plasmon resonances by Chan, Ho Bun, Marcet, Zsolt, Carr, Dustin, Bower, John Eric, Cirelli, Ray, Ferry, Ed, Klemens, Fred P., Miner, John F., Pai, Chien-Shing, Taylor, J. Ashley

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  3. 3
    Advances in Resist Materials for 193nm Lithography

    Advances in Resist Materials for 193nm Lithography by Bowden, Murrae J., Gabor, Allen H., Dimov, Ognian, Medina, Arturo N., Foster, Patrick, Steinhäusler, Thomas, Biafore, John J., Spaziano, Gregory, Slater, Sydney G., Blakeney, Andrew J., Neisser, Mark O., Houlihan, Frank M., Cirelli, Ray A., Dabbagh, Gary, Hutton, Richard S., Rushkin, Ilya L., Sweeney, James R., Timko, Allen G., Nalamasu, Om, Reichmanis, Elsa

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  4. 4
    Advances in Resist Materials for 193 nm Lithography

    Advances in Resist Materials for 193 nm Lithography by Bowden, Murrae J., Gabor, Allen H., Dimov, Ognian, Medina, Arturo N., Foster, Patrick, Steinhäusler, Thomas, Biafore, John J., Spaziano, Gregory, Slater, Sydney G., Blakeney, Andrew J., Neisser, Mark O., Houlihan, Frank M., Cirelli, Ray A., Dabbagh, Gary, Hutton, Richard S., Rushkin, Ilya L., Sweeney, James R., Timko, Allen G., Nalamasu, Om, Reichmanis, Elsa

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  5. 5
    High-Density Solder Bump Interconnect for MEMS Hybrid Integration

    High-Density Solder Bump Interconnect for MEMS Hybrid Integration by Basavanhally, N., Lopez, D., Aksyuk, V., Ramsey, D., Bower, E., Cirelli, R., Ferry, E., Frahm, R., Gates, J., Klemens, F., Lai, W., Low Yee, Mansfield, W., Chien-Shing Pai, Papazian, R., Pardo, F., Sorsch, T., Watson, P.

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  6. 6
    High-density solder bump interconnect for MEMS hybrid in tegration

    High-density solder bump interconnect for MEMS hybrid in tegration by BASAVANHALLY, Nagesh, LOPEZ, Daniel, LAI, Warren, LOW, Yee, MANSFIELD, William, PAI, Chien-Shing, PAPAZIAN, Rick, PARDO, Flavio, SORSCH, Tom, WATSON, Pat, AKSYUK, Vladimir, RAMSEY, Dave, BOWER, Eric, CIRELLI, Ray, FERRY, E, FRAHM, Robert, GATES, John, KLEMENS, Fred

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  7. 7
    Modeling influence of structural changes in photoacid generators on 193 nm single layer resist imaging

    Modeling influence of structural changes in photoacid generators on 193 nm single layer resist imaging by Croffie, Ebo, Yuan, Lei, Cheng, Mosong, Neureuther, Andrew, Houlihan, Frank, Cirelli, Ray, Watson, Pat, Nalamasu, Om, Gabor, Allen

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