Search Results - Coffinan, P.R.

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    High density vertical interconnects for 3-D integration of silicon integrated circuits

    High density vertical interconnects for 3-D integration of silicon integrated circuits by Bower, C.A., Malta, D., Temple, D., Robinson, J.E., Coffinan, P.R., Skokan, M.R., Welch, T.B.

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    High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors

    High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors by Temple, D., Bower, C.A., Malta, D., Robinson, J.E., Coffinan, P.R., Skokan, M.R., Welch, T.B.

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