Search Results - Coudrain, Christophe

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  1. 1
    SIELETERS, an airborne infrared dual-band spectro-imaging system for measurement of scene spectral signatures

    SIELETERS, an airborne infrared dual-band spectro-imaging system for measurement of scene spectral signatures by Coudrain, Christophe, Bernhardt, Sylvie, Caes, Marcel, Domel, Roland, Ferrec, Yann, Gouyon, Rémi, Henry, Didier, Jacquart, Marc, Kattnig, Alain, Perrault, Philippe, Poutier, Laurent, Rousset-Rouvière, Laurent, Tauvy, Michel, Thétas, Sophie, Primot, Jérôme

    Published in Optics express
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  2. 2
    Experimental results from an airborne static Fourier transform imaging spectrometer

    Experimental results from an airborne static Fourier transform imaging spectrometer by Ferrec, Yann, Taboury, Jean, Sauer, Hervé, Chavel, Pierre, Fournet, Pierre, Coudrain, Christophe, Deschamps, Joël, Primot, Jérôme

    Published in Applied optics (2004)
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  3. 3
    MTF measurements of a type-II superlattice infrared focal plane array sealed in a cryocooler

    MTF measurements of a type-II superlattice infrared focal plane array sealed in a cryocooler by Nghiem, Jean, Jaeck, Julien, Primot, Jerome, Coudrain, Christophe, Derelle, Sophie, Huard, Edouard, Caes, Marcel, Bernhardt, Sylvie, Haidar, Riad, Christol, Philippe, Ribet-Mohamed, Isabelle

    Published in Optics express
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  4. 4
    Noise sources in imaging static Fourier transform spectrometers

    Noise sources in imaging static Fourier transform spectrometers by Ferrec, Yann, Ayari-Matallah, Noura, Chavel, Pierre, Goudail, François, Sauer, Hervé, Taboury, Jean, Fontanella, Jean-Claude, Coudrain, Christophe, Primot, Jérôme

    Published in Optical Engineering
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  5. 5
    Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics

    Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics by Vladimirova, Kremena, Widiez, Julie, Letowski, Bastien, Perreau, Pierre, Enyedi, Gregory, Coudrain, Perceval, Rouger, Nicolas, Crebier, Jean-Christophe

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  6. 6
    Electrical and morphological assessment of via middle and backside process technology for 3D integration

    Electrical and morphological assessment of via middle and backside process technology for 3D integration by Colonna, J., Coudrain, P., Garnier, G., Chausse, P., Segaud, R., Aumont, C., Jouve, A., Hotellier, N., Frank, T., Brunet-Manquat, C., Cheramy, S., Sillon, N.

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