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Criteria for approximating a layer in three-dimensional thermal models of multilayer microelectronics
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Creel, K.E.
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Nelson, D.J.
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Thermal modeling of discrete microelectronic elements within three-dimensional continuous models
by
Creel, K.E.
,
Nelson, D.J.
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Conference Proceeding
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Conference Proceedings
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Electronic Packaging Thermal Management
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Heat Transfer
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Microelectronics
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Nonhomogeneous Media
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Boundary Conditions
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Conductivity
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Engineering
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Engineering, Electrical & Electronic
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Engineering, Mechanical
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Equations
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Heat Sinks
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Multichip Modules
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Pins
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Rapid Thermal Processing
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Resistance Heating
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Science & Technology
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Technology
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Thermal Engineering
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Thermal Management Of Electronics
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Thermal Resistance
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Ieee Electronic Library (Iel) Conference Proceedings
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