Search Results - Curnan, H.

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    Ti/Pt/AuSn metallization scheme for bonding of InP-based laser diodes to chemical vapor deposited diamond submounts

    Ti/Pt/AuSn metallization scheme for bonding of InP-based laser diodes to chemical vapor deposited diamond submounts by Katz, A., Wang, K.W., Baiocchi, F.A., Dautremont-Smith, W.C., Lane, E., Luftman, H.S., Varma, R.R., Curnan, H.

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  2. 2
    Large-Scale Hybrid Integrated Circuitry: A Case Study

    Large-Scale Hybrid Integrated Circuitry: A Case Study by Curnan, H., Bokalo, P.

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