Extending acoustic microscopy for comprehensive failure analysis applications by Brand, Sebastian, Czurratis, Peter, Hoffrogge, Peter, Temple, Dorota, Malta, Dean, Reed, Jason, Petzold, Matthias

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Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy by Naumann, Falk, Brand, Sebastian, Bernasch, Michael, Tismer, Sebastian, Czurratis, Peter, Wünsch, Dirk, Petzold, Matthias

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Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy : WaferBond'11, International Conference on Wafer Bonding for Micros... by NAUMANN, Falk, BRAND, Sebastian, BERNASCH, Michael, TISMER, Sebastian, CZURRATIS, Peter, WÜNSCH, Dirk, PETZOLD, Matthias

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Low Temperature Fusion Wafer Bonding Quality Investigation for Failure Mode Analysis by Dragoi, Viorel, Czurratis, Peter, Brand, Sebastian, Beyersdorfer, Jens, Patzig, Christian, Krugers, Jan-Paul, Schrank, Franz, Siegert, Joerg, Petzold, Matthias

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A Study of Factors Influencing Micro-Chevron-Testing of Glass Frit Bonded Interfaces by Naumann, Falk, Bernasch, Michael, Brand, Sebastian, Wünsch, Dirk, Vogel, Klaus, Czurratis, Peter, Petzold, Matthias

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Extending acoustic microscopy for comprehensive failure analysis applications: Failure Analysis in Electronics: An EDFAS Special Issue by BRAND, Sebastian, CZURRATIS, Peter, HOFFROGGE, Peter, TEMPLE, Dorota, MALTA, Dean, REED, Jason, PETZOLD, Matthias

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High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in Through Silicon Vias by Phommahaxay, Alain, De Wolf, Ingrid, Hoffrogge, Peter, Brand, Sebastian, Czurratis, Peter, Philipsen, Harold, Civale, Yann, Vandersmissen, Kevin, Halder, Sandip, Beyer, Gerald, Swinnen, Bart, Miller, Andy, Beyne, Eric

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Failure Diagnostics for 3D System Integration Technologies in Microelectronics by Altmann, Frank, Schmidt, Christian, Brand, Sebastian, Czurratis, Peter, Petzold, Matthias

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Automated Defect Classification In Semiconductor Devices Using Deep Learning Networks by Nair, Arya Sukumaran, Hoffrogge, Peter, Czurratis, Peter, Kuehnicke, Elfgard, Wolf, Mario

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Scanning Acoustic Microscopy for Quantifying Two-phase Transfer in Operando Alkaline Water Electrolyzer by Dou, Zehua, Rox, Hannes, Ramos, Zyzi, Baumann, Robert, Ravishankar, Rachappa, Czurratis, Peter, Yang, Xuegeng, Andrés Fabian Lasagni, Eckert, Kerstin, Czarske, Juergen, Weik, David

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Acoustic GHz-microscopy and its potential applications in 3D-integration technologies by Brand, Sebastian, Appenroth, Tim, Naumann, Falk, Steller, Wolfram, Wolf, M. Jurgen, Czurratis, Peter, Altmann, Frank, Petzold, Matthias

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Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis by Tismer, Sebastian, Brand, Sebastian, Klengel, Sandy, Petzold, Matthias, Czurratis, Peter

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Defect detection in Through Silicon Vias by GHz Scanning Acoustic Microscopy: Key ultrasonic characteristics by Phommahaxay, Alain, De Wolf, Ingrid, Djuric, Tatjana, Hoffrogge, Peter, Brand, Sebastian, Czurratis, Peter, Philipsen, Harold, Beyer, Gerald, Struyf, Herbert, Beyne, Eric

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Scanning acoustic microscopy an application for evaulating varnish layer conditions non-destructively by Brand, S., Raum, K., Czurratis, P.

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High resolution acoustical imaging of high-density-interconnects for 3D-integration by Brand, Sebastian, Petzold, Matthias, Czurratis, Peter, Reed, Jason D., Lueck, Matthew, Gregory, Chris, Huffman, Alan, Lannon, John M., Temple, Dorota S.

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Acoustic inspection of high-density-interconnects for 3D-integration by Brand, S., Petzold, M., Czurratis, P., Reed, J. D., Lueck, M., Gregory, C., Huffman, A., Lennon, J. M., Temple, D. S.

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