Autistic Perspectives on the Future of Clinical Autism Research by Pukki, Heta, Bettin, Jorn, Outlaw, Avery Grey, Hennessy, Joshua, Brook, Kabie, Dekker, Martijn, Doherty, Mary, Shaw, Sebastian C K, Bervoets, Jo, Rudolph, Silke, Corneloup, Thibault, Derwent, Kylieanne, Lee, Onemoo, Rojas, Yadira Garcia, Lawson, Wenn, Gutierrez, Monica Vidal, Petek, Kosjenka, Tsiakkirou, Myria, Suoninen, Annikka, Minchin, Jo, Döhle, Rainer, Lipinski, Silke, Natri, Heini, Reardon, Emma, Estrada, Giovanna Villarreal, Platon, Ovidiu, Chown, Nick, Satsuki, Ayaya, Milton, Damian, Walker, Nick, Roldan, Ondrej, Herrán, Bárbara, Cañedo, Citlali Limón, McCowan, Sue, Johnson, Mona, Turner, Eleanor Jane, Lammers, Jessy, Yoon, Wn-Ho

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Room temperature wedge–wedge ultrasonic bonding using aluminum coated copper wire by Dohle, Rainer, Petzold, Matthias, Klengel, Robert, Schulze, Holger, Rudolf, Frank

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Room temperature wedge-wedge ultrasonic bonding using aluminum coated copper wire: COPPER WIRE BONDING by DOHLE, Rainer, PETZOLD, Matthias, KLENGEL, Robert, SCHULZE, Holger, RUDOLF, Frank

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New Packaging Technology for Disruptive 1- and 2- Dimensional VCSEL Arrays and Their Electro- Optical Performance and Applications by Dohle, Rainer, Henning, Gerold, Friedrich, Thomas, Wallrodt, Maximilian, Greus, Christoph, Neumeyr, Christian, Rosskopf, Jurgen, Hohenleitner, Robert

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Investigation of electromigration behaviour in lead-free flip-chip solders connections by Dohle, Rainer, Gorywoda, Marek, Wirth, Andreas, Gosler, Jörg

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On the failure mechanism in lead-free flip-chip interconnects comprising ENIG finish during electromigration by Gorywoda, Marek, Dohle, Rainer, Wirth, Andreas, Burger, Bernd, Gossler, Jorg

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A new cost effective packaging technique for optoelectronic devices by Rainer Dohle, G., Callahan, J.J., Drabik, T.J., Martin, K.P.

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A new bonding technique for microwave devices by Rainer Dohle, G., Callahan, J.J., Martin, K.P., Drabik, T.J.

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Reliability study of lead-free flip-chips with solder bumps down to 30 μm diameter by Harter, S., Dohle, R., Reinhardt, A., Gosler, J., Franke, J.

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Processing and reliability analysis of flip-chips with solder bumps down to 30 μm diameter by Franke, J., Dohle, R., Schusler, F., Oppert, T., Friedrich, T., Harter, S.

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Adapted assembly processes for flip-chip technology with solder bumps of 50 µm or 40 µm diameter by Dohle, Rainer, Schüssler, Florian, Friedrich, Thomas, Gossler, Jörg, Oppert, Thomas, Franke, Jörg

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Alignable lift-off transfer of device arrays via a single polymeric carrier membrane by Callahan, J.J., Dohle, R., Martin, K.P., Drabik, T.J.

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Low temperature bonding of epitaxial lift off devices with AuSn by Dohle, G.R., Drabik, T.J., Callahan, J.J., Martin, K.P.

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Association of Administration of Surfactant Using Less Invasive Methods With Outcomes in Extremely Preterm Infants Less Than 27 Weeks of Gestation by Härtel, Christoph, Herting, Egbert, Humberg, Alexander, Hanke, Kathrin, Mehler, Katrin, Keller, Titus, Mauer, Isabell, Frieauff, Eric, Meyer, Sascha, Thome, Ulrich H, Wieg, Christian, Schmidtke, Susanne, Kribs, Angela, Göpel, Wolfgang

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Neonatal Sepsis Episodes and Retinopathy of Prematurity in Very Preterm Infants by Glaser, Kirsten, Härtel, Christoph, Klingenberg, Claus, Herting, Egbert, Fortmann, Mats I, Speer, Christian P, Stensvold, Hans J, Huncikova, Zuzana, Rønnestad, Arild E, Nentwich, Martin M, Stahl, Andreas, Dammann, Olaf, Göpel, Wolfgang

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