Nonlinear flux flow in TiN superconducting thin film by Lefloch, F., Hoffmann, C., Demolliens, O.

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Formation of Al3Ti during physical vapour deposition of titanium on aluminium by Ulmer, L., Pitard, F., Poncet, D., Demolliens, O.

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Dielectric deposition process for Cu/SiO2 integration in a dual damascene interconnection architecture by MOTTE, P, TORRES, J, PALLEAU, J, TARDIF, F, DEMOLLIENS, O, BERNARD, H

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Cleaning after silicon oxide CMP by Tardif, F., Constant, I., Lardin, T., Demolliens, O., Fayolle, M., Gobil, Y., Palleau, J., Torres, J.

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Wet cleanings adapted to backend processes by Tardif, F., Palleau, J., Lardin, T., Demolliens, O., Vincent, A., Torres, J.

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Study of fluorine stability in fluoro-silicate glass and effects on dielectric properties by Passemard, Gérard, Fugier, Pascal, Noel, Patrice, Pires, Fabrice, Demolliens, Olivier

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Dielectric deposition process for Cu/SiO sub(2) integration in a dual damascene interconnection architecture by Motte, P, Torres, J, Palleau, J, Tardif, F, Demolliens, O, Bernard, H

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Dielectric deposition process for Cu/SiO 2 integration in a dual damascene interconnection architecture by Motte, P, Torres, J, Palleau, J, Tardif, F, Demolliens, O, Bernard, H

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Properties of Nb3Ge tapes for high field magnets by DEMOLLIENS, O, WEISS, F, MADAR, R, SENATEUR, J. P, VALLIER, J. C

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Formation of Al sub 3 Ti during physical vapour deposition of titanium on aluminium by Ulmer, L, Pitard, F, Poncet, D, Demolliens, O

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Dielectric deposition process for Cu/SiO sub 2 integration in a dual damascene interconnection architecture by Motte, P, Torres, J, Palleau, J, Tardif, F, Demolliens, O, Bernard, H

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Formation of Al 3Ti during physical vapour deposition of titanium on aluminium by Ulmer, L., Pitard, F., Poncet, D., Demolliens, O.

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New strategy to improve the mechanical strength and to reduce potential contamination of dielectric materials for double level metal integration by Assous, M., Morand, Y., Demolliens, O., Berruyer, P., Manierre, B., Gobil, Y., Louis, D., Feldis, H., Vizioz, C., Roman, A.

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Copper dual damascene integration using organic low k material: construction architecture comparison by Morand, Y., Assous, M., Berruyer, P., Cochet, M., Demolliens, O., Fayolle, M., Louis, D., Passemard, G., Roman, A., Verove, C., Trouiller, Y.

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Copper-SiOC-AirGap integration in a double level metal interconnect by Demolliens, O., Morand, Y., Fayolle, M., Cochet, M., Assous, M., Feldis, H., Lonis, D., Royer, J.C., Gobil, Y., Passemard, G., Maury, P., Jourdan, F., Cordeau, M., Morel, T., Perroud, L., Ulmer, L., Lugard, J.F., Renaud, D.

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Copper-silk integration in a 0.18μm double level metal interconnect by DEMOLLIENS, O, BERRUYER, P, LOUIS, D, ARVET, C, LAJOINIE, E, GOBIL, Y, PASSEMARD, G, JOURDAN, F, MOUSSAVI, M, CORDEAU, M, MOREL, T, MOURIER, T, MORAND, Y, ULMER, L, SICURANI, E, TARDIF, F, BEVERINA, A, TROUILLET, Y, RENAUD, D, TABONE, C, ROMAN, A, COCHET, M, ASSOUS, M, FELDIS, H, BLANC, R, TABOURET, E

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Differential body effect analysis and optimization of the LArge Tilt Implanted Sloped Shallow Trench Isolation Process (LATI-STI) by DELEONIBUS, S, HEITMANN, M, GOBIL, Y, MARTIN, F, DEMOLLIENS, O, GUIBERT, J.-C, TOFFOLI, A

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Copper Integration In Self Aligned Dual Damascene Architecture by Morand, Lerme, Palleau, Torres, Vinet, Demolliens, Ulmer, Gobil, Fayolle, Romagna, Le Bihan

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Shallow Trench Isolation for High Density Flash Memories by Deleonibus, S., Heitzmann, M., Gobil, Y., Martin, F., Demolliens, O., Guillaumot, B., Candelier, P., Guibert, J.C.

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Properties of Nb sub 3 Ge Tapes for High Field Magnets by Demolliens, O, Weiss, F, Madar, R, Senateur, J P

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