Cradle-to-Gate Life Cycle Assessment (LCA) of GaN Power Semiconductor Device by Vauche, Laura, Guillemaud, Gabin, Lopes Barbosa, Joao-Carlos, Di Cioccio, Léa

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Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration by Gueguen, Pierric, Ventosa, Caroline, Cioccio, Léa Di, Moriceau, Hubert, Grossi, François, Rivoire, Maurice, Leduc, Patrick, Clavelier, Laurent

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3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly by Fazzi, A., Magagni, L., Mirandola, M., Charlet, B., Di Cioccio, L., Jung, E., Canegallo, R., Guerrieri, R.

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Capillary self-alignment of polygonal chips: a generalization for the shift-restoring force by Berthier, Jean, Mermoz, Sébastien, Brakke, Kenneth, Sanchez, Loic, Frétigny, Christian, Cioccio, Léa Di

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Copper Direct-Bonding Characterization and Its Interests for 3D Integration by Gueguen, Pierric, Di Cioccio, Léa, Gergaud, Patrice, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent

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Low-Footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-Based Microdisk Lasers and Microdetectors by Van Campenhout, J., Binetti, P.R.A., Romeo, P.R., Regreny, P., Seassal, C., Leijtens, X.J.M., de Vries, T., Yoki Siang Oei, van Veldhoven, R.P.J., Notzel, R., Di Cioccio, L., Fedeli, J.-M., Smit, M.K., Van Thourhout, D., Baets, R.

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A Compact SOI-Integrated Multiwavelength Laser Source Based on Cascaded InP Microdisks by Van Campenhout, J., Liu Liu, Romeo, P.R., Van Thourhout, D., Seassal, C., Regreny, P., Di Cioccio, L., Fedeli, J.-M., Baets, R.

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Direct bonding for wafer level 3D integration by Di Cioccio, Lea, Radu, Ionut, Gueguen, Pierric, Sadaka, Mariam

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Copper direct bonding: An innovative 3D interconnect by Gueguen, Pierric, Di Cioccio, Léa, Morfouli, Panagiota, Zussy, Marc, Dechamp, Jérome, Bally, Laurent, Clavelier, Laurent

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Comment réduire l’impact environnemental de la microélectronique dans un domaine du semi-conducteur en pleine évolution ? by Dauvé, Sébastien, Di Cioccio, Léa

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Comment réduire l'impact environnemental de la microélectronique dans un domaine du semi-conducteur en pleine évolution ? by Dauve, Sébastien, Di Cioccio, Léa

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Hydrogen implantation-induced blistering in diamond : towards diamond layer transfer by the Smart CutTM technique by Masante, Cédric, de Vecchy, Jon, Mazen, Frédéric, Milesi, Frederic, Di Cioccio, Léa, Pernot, Julien, Lloret, Fernando, Araujo, Daniel, Pinero, José Carlos, Rochat, Névine, Pierre, Francois, Servant, Florence, Widiez, Julie

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Design and Optimization of Electrically Injected InP-Based Microdisk Lasers Integrated on and Coupled to a SOI Waveguide Circuit by Van Campenhout, J., Romeo, P.R., Van Thourhout, D., Seassal, C., Regreny, P., Di Cioccio, L., Fedeli, J.-M., Baets, R.

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Contribution of numerical simulation to silicon carbide bulk growth and epitaxy by Meziere, Jérôme, Pons, Michel, Cioccio, Léa Di, Blanquet, Elisabeth, Ferret, Pierre, Dedulle, Jean-Marc, Baillet, Francis, Pernot, Etienne, Anikin, Michaïl, Madar, Roland, Billon, Thierry

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Modeling and Integration Phenomena of metal-metal direct bonding technology by Di Cioccio, Lea, Baudin, Floriane, Gergaud, Patrice, Delaye, Vincent, Jouneau, Pierre-Henri, Rieutord, François, Signamarcheix, Thomas

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Vertical metal interconnect thanks to tungsten direct bonding by Di Cioccio, Léa, Gueguen, Pierric, Grouiller, Etienne, Vandroux, Laurent, Delaye, Vincent, Rivoire, Maurice, Lugand, Jean François, Clavelier, Laurent

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Copper Direct Bonding Characterization and its Interests for 3D Integration Circuits by Gueguen, Pierric, Di Cioccio, Léa, Gergaud, Patrice, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent

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Room-temperature InAs/InP Quantum Dots laser operation based on heterogeneous "2.5 D" Photonic Crystal by Ben Bakir, Badhise, Seassal, Christian, Letartre, Xavier, Regreny, Philippe, Gendry, Michel, Viktorovitch, Pierre, Zussy, Marc, Di Cioccio, Léa, Fedeli, Jean-Marc

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Full characterization of Cu/Cu direct bonding for 3D integration by Taibi, Rachid, Di Cioccio, Léa, Chappaz, Cedrick, Chapelon, Laurent-Luc, Gueguen, Pierric, Dechamp, Jérome, Fortunier, Roland, Clavelier, Laurent

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New Heterostructures and 3D Devices Obtained at CEA/LETI by the Bonding and Thinning Method by Di Cioccio, Léa

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