Search Results - Dai, W.W.

Refine Results
  1. 1
    Coupling laser physics to radiation-hydrodynamics

    Coupling laser physics to radiation-hydrodynamics by Haines, Brian M., Keller, D.E., Marozas, J.A., McKenty, P.W., Anderson, K.S., Collins, T.J.B., Dai, W.W., Hall, M.L., Jones, S., McKay Jr, M.D., Rauenzahn, R.M., Woods, D.N.

    Published in Computers & fluids
    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    The three-dimensional structures of methanol dehydrogenase from two methylotrophic bacteria at 2.6-A resolution

    The three-dimensional structures of methanol dehydrogenase from two methylotrophic bacteria at 2.6-A resolution by ZONG-XIANG XIA, WEI-WEN DAI, JIAN-PING XIONG, ZHI-PING HAO, DAVIDSON, V. L, WHITE, S, MATHEWS, F. S

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  3. 3
    Wear mechanism of plasma-sprayed TiO2 coating against stainless steel

    Wear mechanism of plasma-sprayed TiO2 coating against stainless steel by DAI, W. W, DING, C. X, LI, J. F, ZHANG, Y. F, ZHANG, P. Y

    Published in Wear
    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  4. 4
    A case study on migration from IEC 61131 PLC to IEC 61499 function block control

    A case study on migration from IEC 61131 PLC to IEC 61499 function block control by Dai, W.W., Vyatkin, V.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  5. 5
    Numerical simulations for radiation hydrodynamics. 2: Transport limit

    Numerical simulations for radiation hydrodynamics. 2: Transport limit by Dai, W.W., Woodward, P.R.

    Get full text
    Article
    Save to List
    Saved in:
  6. 6
    A novel dimension-reduction technique for the capacitance extraction of 3-D VLSI interconnects

    A novel dimension-reduction technique for the capacitance extraction of 3-D VLSI interconnects by Hong, Wei, Wei-Kai Sun, Zhen-Hai Zhu, Hao Ji, Ben Song, Dai, W.W.-M.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  7. 7
    Chip Parasitic Extraction And Signal Integrity Verification

    Chip Parasitic Extraction And Signal Integrity Verification by Dai, W.W.-M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  8. 8
    Wear mechanism of plasma-sprayed TiO 2 coating against stainless steel

    Wear mechanism of plasma-sprayed TiO 2 coating against stainless steel by Dai, W.W., Ding, C.X., Li, J.F., Zhang, Y.F., Zhang, P.Y.

    Published in Wear
    Get full text
    Article
    Save to List
    Saved in:
  9. 9
    Wave spreading evaluation of interconnect systems

    Wave spreading evaluation of interconnect systems by Haifang Liao, Dai, W.W.-M.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  10. 10
    Optimal design of self-damped lossy transmission lines for multichip modules

    Optimal design of self-damped lossy transmission lines for multichip modules by Wang, J.S.-H., Dai, W.W.-M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  11. 11
    Useful-skew clock routing with gate sizing for low power design

    Useful-skew clock routing with gate sizing for low power design by Xi, J.G., Dai, W.W.-M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  12. 12
    Transient analysis of coupled transmission lines characterized with the frequency-dependent losses using scattering-parameter based macromodel

    Transient analysis of coupled transmission lines characterized with the frequency-dependent losses using scattering-parameter based macromodel by Wang, J.S.-H., Dai, W.W.-M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  13. 13
    Hierarchical placement and floorplanning in BEAR

    Hierarchical placement and floorplanning in BEAR by Dai, W.W.-M.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  14. 14
    A Method for Generation Random Circuits and Its Application to Routability Measurement

    A Method for Generation Random Circuits and Its Application to Routability Measurement by Darnauer, J., Dai, W.W.

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  15. 15
    Modeling and analysis of integrated spiral inductors for RF system-in-package

    Modeling and analysis of integrated spiral inductors for RF system-in-package by Minqing Liu, Dai, W.W.-M.

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  16. 16
    Arbitrary rectilinear block packing based on sequence pair

    Arbitrary rectilinear block packing based on sequence pair by Kang, Maggie Zhiwei, Dai, Wayne Wei-Mingi

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  17. 17
    High-Level Bit-Serial Datapath Synthesis for Multi-FPGA Systems

    High-Level Bit-Serial Datapath Synthesis for Multi-FPGA Systems by Isshiki, T., Dai, W.W.

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  18. 18
    Silicon-on-silicon multichip modules: technology and applications

    Silicon-on-silicon multichip modules: technology and applications by Dai, W.W.-M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  19. 19
    General floorplanning with L-shaped, T-shaped and soft blocks based on bounded slicing grid structure

    General floorplanning with L-shaped, T-shaped and soft blocks based on bounded slicing grid structure by Kang, M., Dai, W.W.-M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  20. 20
    Performance driven layout of thin-film substrates for multichip modules

    Performance driven layout of thin-film substrates for multichip modules by Dai, W.W.-M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: