Search Results - Dai, Wayne Wei-Ming

Refine Results
  1. 1
    Planar clock routing for high performance chip and package co-design

    Planar clock routing for high performance chip and package co-design by ZHU, Q, DAI, W. W.-M

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    Tradeoffs in chip and substrate complexity and cost for field programmable multichip modules

    Tradeoffs in chip and substrate complexity and cost for field programmable multichip modules by Darnauer, J., Wayne Wei-Ming Dai

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  3. 3
    Historical Perspective of System in Package (SiP)

    Historical Perspective of System in Package (SiP) by Dai, Wayne Wei-Ming

    Get full text
    Items that this one cites
    Items that cite this one
    Magazinearticle
    Save to List
    Saved in:
  4. 4
    Arbitrary rectilinear block packing based on sequence pair

    Arbitrary rectilinear block packing based on sequence pair by Kang, Maggie Zhiwei, Dai, Wayne Wei-Mingi

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  5. 5
    Yield-preferred via insertion based on novel geotopological technology

    Yield-preferred via insertion based on novel geotopological technology by Luo, Fangyi, Jia, Yongbo, Dai, Wayne Wei-Ming

    Get full text
    Conference Proceeding
    Save to List
    Saved in:
  6. 6
    Routability of a rubber-band sketch

    Routability of a rubber-band sketch by Dai, Wayne Wei-Ming, Kong, Raymond, Sato, Masao

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  7. 7
    S-parameter based macro model of distributed-lumped networks using exponentially decayed polynomial function

    S-parameter based macro model of distributed-lumped networks using exponentially decayed polynomial function by Liao, Haifang, Dai, Wayne Wei-Ming, Wang, Rui, Chang, Fung-Yuel

    Get full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  8. 8
    Multichip Routing and Placement

    Multichip Routing and Placement by Dai, Wayne Wei-Ming

    Published in IEEE spectrum
    Get full text
    Magazinearticle
    Save to List
    Saved in:
  9. 9
    Wave spreading evaluation of interconnect systems

    Wave spreading evaluation of interconnect systems by Liao, H., Dai, W.W.-M.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  10. 10
    A silicon-on-silicon field programmable multichip module (FPMCM) integrating FPGA and MCM technologies

    A silicon-on-silicon field programmable multichip module (FPMCM) integrating FPGA and MCM technologies by Darnauer, J., Isshiki, T., Garay, P., Ramirez, J., Maheshwari, V., Dai, W.W.-M.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  11. 11
    A novel dimension-reduction technique for the capacitance extraction of 3-D VLSI interconnects

    A novel dimension-reduction technique for the capacitance extraction of 3-D VLSI interconnects by Hong, Wei, Wei-Kai Sun, Zhen-Hai Zhu, Hao Ji, Ben Song, Dai, W.W.-M.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  12. 12
    Cost-driven layout for thin-film MCMs

    Cost-driven layout for thin-film MCMs by Dai, W.W.-M., Staepelaere, D., Jue, J., Dayan, T.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  13. 13
    Wave spreading evaluation of interconnect systems

    Wave spreading evaluation of interconnect systems by Haifang Liao, Dai, W.W.-M.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  14. 14
    Single-layer fanout routing and routability analysis for ball grid arrays

    Single-layer fanout routing and routability analysis for ball grid arrays by Man-Fai Yu, Wei-Ming Dai, W.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  15. 15
    Yield-preferred via insertion based on novel geotopological technology

    Yield-preferred via insertion based on novel geotopological technology by Fangyi Luo, Yongbo Jia, Wayne Wei-Ming Dai

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  16. 16
    Hierarchical placement and floorplanning in BEAR

    Hierarchical placement and floorplanning in BEAR by Dai, W.W.-M.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  17. 17
    Partitioning and reduction of RC interconnect networks based on scattering parameter macromodels

    Partitioning and reduction of RC interconnect networks based on scattering parameter macromodels by Haifang Liao, Wei-Ming Dai, W.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  18. 18
    S parameter-based experimental modeling of high Q MCM inductor with exponential gradient learning algorithm

    S parameter-based experimental modeling of high Q MCM inductor with exponential gradient learning algorithm by Jinsong Zhao, Frye, R.C., Dai, W.W.-M., Tai, K.L.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  19. 19
    Sensitivity analysis of interconnect networks based on S-parameter macromodel

    Sensitivity analysis of interconnect networks based on S-parameter macromodel by Yanhua Sun, Wayne Wei-Ming Dai

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  20. 20
    Interchangeable pin routing with application to package layout

    Interchangeable pin routing with application to package layout by Yu, Man-Fai, Darnauer, Joel, Dai, Wayne Wei-Ming

    Get full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: