Search Results - Dambrowsky, Nina

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  1. 1
    Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes

    Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes by Roelfs, Bernd, Dambrowsky, Nina, Erben, Christof, Kenny, Stephen

    Published in Circuit world
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  2. 2
    A chip-based platform for the in vitro generation of tissues in three-dimensional organization

    A chip-based platform for the in vitro generation of tissues in three-dimensional organization by Gottwald, Eric, Giselbrecht, Stefan, Augspurger, Caroline, Lahni, Brigitte, Dambrowsky, Nina, Truckenmüller, Roman, Piotter, Volker, Gietzelt, Thomas, Wendt, Oliver, Pfleging, Wilhelm, Welle, Alex, Rolletschek, Alexandra, Wobus, Anna M, Weibezahn, Karl-Friedrich

    Published in Lab on a chip
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  3. 3
    Via filling: Challenges for the plating process for conveyorised production

    Via filling: Challenges for the plating process for conveyorised production by Kenny, S., Dambrowsky, N., Mann, O.

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