Novel α-amine-functionalized silica-based dispersions for selectively polishing polysilicon and Si(1 0 0) over silicon dioxide, silicon nitride or copper during chemical mechanical... by Veera Dandu, P.R., Penta, Naresh K., Babu, S.V.

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Reverse selectivity – High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions by Veera Dandu, P.R., Devarapalli, V.K., Babu, S.V.

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Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical–Mechanical Planarization of silica surfaces by Volkov, D.O., Dandu, P.R Veera, Goodman, H., Santora, B., Sokolov, I.

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Role of polycation adsorption in poly-Si, SiO₂ and Si₃N₄ removal during chemical mechanical polishing: Effect of polishing pad surface chemistry by Penta, Naresh K, Matovu, John B, Veera, P.R. Dandu, Krishnan, Sitaraman, Babu, S.V

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Novel phosphate-functionalized silica-based dispersions for selectively polishing silicon nitride over silicon dioxide and polysilicon films by Veera Dandu, P.R., Penta, Naresh K., Peethala, B.C., Babu, S.V.

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Role of amines and amino acids in enhancing the removal rates of undoped and P-doped polysilicon films during chemical mechanical polishing by Veera Dandu, P.R., Peethala, B.C., Penta, Naresh K., Babu, S.V.

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Role of polycation adsorption in poly-Si, SiO 2 and Si 3N 4 removal during chemical mechanical polishing: Effect of polishing pad surface chemistry by Penta, Naresh K., Matovu, John B., Veera, P.R. Dandu, Krishnan, Sitaraman, Babu, S.V.

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