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Warpage measurement of large area multitilted silicon substrates at various processing conditions
by
Bhattacharya, S.K.
,
Ume, I.C.
,
Dang, A.X.H.
Published in
IEEE transactions on components and packaging technologies
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Active acceleration compensation for transport vehicles carrying delicate objects
by
Dang, A.X.H.
,
Ebert-Uphoff, I.
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IEEE transactions on robotics
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Process induced warpage in multitiled alumina substrates for large area MCM-D processing
by
Dang, A.X.H.
,
Ume, I.C.
,
Bhattacharya, S.K.
Published in
IEEE transactions on advanced packaging
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