Development of Glass-Based Micro-Patterned Dry Film Bonding for mm-W Device Integration by Cai, Jing, Zhou, Qing, Zhang, Miao, Wu, Shu Yue, Yu, Daquan, Liu, Qing Huo

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Quasi‐2D Phonon Transport in Diamond Nanosheet by Zhu, Yunting, Ye, Tian, Wen, Hailang, Xu, Rongbin, Zhong, Yi, Lin, Guangyang, Liang, Dongxue, Cai, Weiwei, Yu, Daquan, Lin, Weiyi

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On the optimization of molding warpage for wafer-level glass interposer packaging by Bao, Shuchao, Li, Wei, He, Yimin, Zhong, Yi, Zhang, Long, Yu, Daquan

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Wafer-Level Packaging Technology Of W-Band Antennas Based On Through Glass by Jia, Ning, Wei, Yan, Ruan, Wenbiao, Xu, Fangming, Yu, Daquan

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Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping by Chen, Zuohuan, Yu, Daquan, Zhang, Mingchuan, Jiang, Feng

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Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces by Zhou, Shangtong, Jiang, Xiaofan, Zhong, Yi, Yu, Daquan, Cheng, Qijin

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Depth estimation of multi-depth objects based on computational ghost imaging system by Zhang, Wenwen, Yu, Daquan, Han, Yongcheng, He, Weiji, Chen, Qian, He, Ruiqing

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High‐Gain of NdIII Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 µm Wavelengths Based on Intramolecular Energy Transfer Mechanism (Adv. Mater. 12/2023) by Lin, Zhuliang, Man, Yi, Lv, Ziyue, Zhang, Baoping, Xu, Hui, Yu, Daquan, Yang, Xingchen, He, Yan, Shi, Xiaowu, Ying, Leiying, Zhang, Dan

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High‐Gain of NdIII Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 µm Wavelengths Based on Intramolecular Energy Transfer Mechanism by Lin, Zhuliang, Man, Yi, Lv, Ziyue, Zhang, Baoping, Xu, Hui, Yu, Daquan, Yang, Xingchen, He, Yan, Shi, Xiaowu, Ying, Leiying, Zhang, Dan

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High‐Gain of Nd III Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 µm Wavelengths Based on Intramolecular Energy Transfer Mechanism (Adv. Mater. 12/2023) by Lin, Zhuliang, Man, Yi, Lv, Ziyue, Zhang, Baoping, Xu, Hui, Yu, Daquan, Yang, Xingchen, He, Yan, Shi, Xiaowu, Ying, Leiying, Zhang, Dan

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High-Gain of Nd III Complex Doped Optical Waveguide Amplifiers at 1.06 and 1.31 µm Wavelengths Based on Intramolecular Energy Transfer Mechanism by Lin, Zhuliang, Man, Yi, Lv, Ziyue, Zhang, Baoping, Xu, Hui, Yu, Daquan, Yang, Xingchen, He, Yan, Shi, Xiaowu, Ying, Leiying, Zhang, Dan

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Simulation of through via bottom-up copper plating with accelerator for the filling of TSVs by 伍恒 唐祯安 王竹 程万 于大全

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Selective metallization of glass with improved adhesive layer and optional hydrophobic surface by Huang, Dongxu, Huang, Mingqi, Sun, Deliang, Liu, Bincan, Xuan, Rui, Liu, Jinshan, Sun, Rong, Li, Jinhui, Zhang, Guoping, Yu, Daquan

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Demonstration of Optical Gain at 1535 nm Based on ErIII Complex‐Doped Polymer Waveguides Under Light‐Emitting Diode Excitation by He, Yan, Man, Yi, Shi, Xiaowu, Xu, Hui, Lin, Zhuliang, Zhang, Baoping, Yu, Daquan, Huang, Yuyang, Zhang, Dan

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Demonstration of Optical Gain at 1535 nm Based on Er III Complex‐Doped Polymer Waveguides Under Light‐Emitting Diode Excitation by He, Yan, Man, Yi, Shi, Xiaowu, Xu, Hui, Lin, Zhuliang, Zhang, Baoping, Yu, Daquan, Huang, Yuyang, Zhang, Dan

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An Air-Filled Double-Sided Gap Waveguide Based on Glass Packaging for mm-W Applications by Cai, Jing, Zhang, Miao, Yu, Chen, Yu, Daquan, Liu, Qing Huo

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Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers by Jiang, Xiaofan, Tao, Zeming, Li, Yuan, Sun, Fangyuan, Yu, Daquan, Zhong, Yi

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Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs by Yao, Mingjun, Zhao, Ning, Wang, Teng, Yu, Daquan, Xiao, Zhiyi, Ma, Haitao

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Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes by Qin, Fei, Zhao, Shuai, Dai, Yanwei, Yang, Mengke, Xiang, Min, Yu, Daquan

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Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress by Wang, Fangcheng, Liu, Qiang, Xia, Jianwen, Huang, Mingqi, Wang, Xuefan, Dai, Wenxue, Zhang, Guoping, Yu, Daquan, Li, Jinhui, Sun, Rong

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