Search Results - Daquan Yu

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  1. 141
    Sensorized guidewires with MEMS tri-axial force sensor for minimally invasive surgical applications

    Sensorized guidewires with MEMS tri-axial force sensor for minimally invasive surgical applications by Liang Lou, Ramakrishna, Kotlanka, Lichun Shao, Woo-Tae Park, Daquan Yu, Lishiah Lim, Yongjun Wee, Kripesh, Vaidyanathan, Hanhua Feng, Chua, Benjamin S Y, Chengkuo Lee, Dim-Lee Kwong

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  2. 142
    An experimental verified model for Cu electrodeposition simulation for the filling of high aspect ratio through silicon vias

    An experimental verified model for Cu electrodeposition simulation for the filling of high aspect ratio through silicon vias by Heng Wu, Zhen-an Tang, Zhu Wang, Wan Cheng, Chongsheng Song, Daquan Yu, Lixi Wan

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  3. 143
    Effects of via pitch on silicon stress in TSV interposer

    Effects of via pitch on silicon stress in TSV interposer by An Tong, Qin Fei, Wu Wei, Yu Daquan, Wan Lixi, Wang Jun

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  4. 144
    Development of new TSV structure composing of intermetallic compounds

    Development of new TSV structure composing of intermetallic compounds by Daquan Yu, Xiaoyang Liu, Ran He, Xiangmeng Jing, Chongshen Song, Fengwei Dai, Yu Sun, Lixi Wan

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  5. 145
    Nonlinear thermo-mechanical analysis of TSV interposer filling with solder, Cu and Cu-cored solder

    Nonlinear thermo-mechanical analysis of TSV interposer filling with solder, Cu and Cu-cored solder by Ran He, Huijuan Wang, Jing Zhou, Xueping Guo, Daquan Yu, Lixi Wan

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  6. 146
    Completely Filling of Through-Silicon-Vias with High Aspect Ratio by High Cavity Physical Vapor Deposition and Electroplating

    Completely Filling of Through-Silicon-Vias with High Aspect Ratio by High Cavity Physical Vapor Deposition and Electroplating by Wang, Manyu, Li, Ke, Bao, Shuchao, Liu, Zhongliang, Zhu, Yunting, Wang, Jiahui, Xia, Qifei, Wu, Shaocheng, Yu, Daquan

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  7. 147
    Nonlinear thermal stress & strain analysis of through silicon vias with different structures and polymer filling

    Nonlinear thermal stress & strain analysis of through silicon vias with different structures and polymer filling by Jing Zhou, Daquan Yu, Ran He, Feng WeiDai, Xueping Guo, Chongshen Song, HuiJuan Wang, Guidotti, D., Liqiang Cao, Lixi Wan

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  8. 148
    Newly developed in-situ formation of SnAg and SnAgCu solder on copper pillar bump

    Newly developed in-situ formation of SnAg and SnAgCu solder on copper pillar bump by Fengwei Dai, Daquan Yu, Wen Yin, Ning Zhao, Lixi Wan, Han Yu, Su Wang, Jiangyan Sun

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  9. 149
    Development of micro-alloying method for Cu pillar solder bump by solid liquid interaction

    Development of micro-alloying method for Cu pillar solder bump by solid liquid interaction by Wen Yin, Daquan Yu, Fengwei Dai, Chongshen Song, Zhang Bo, Lixi Wan, Han Yu, Jiangyan Sun

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  10. 150
    Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros

    Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros by Pan, Jie, Wang, Huijuan, Tian, Gengxin, Cao, Liqiang, Yu, Daquan

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  11. 151
    Development of low temperature bonding using in-based solders

    Development of low temperature bonding using in-based solders by Won Kyoung Choi, Daquan Yu, Chengkuo Lee, Liling Yan, Yu, A., Seung Wook Yoon, Lau, J.H., Moon Gi Cho, Yoon Hwan Jo, Hyuck Mo Lee

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  12. 152
    3D modeling and simulation of heat transfer for internal channel cooling of 3D-chip stacks

    3D modeling and simulation of heat transfer for internal channel cooling of 3D-chip stacks by Jing Zhang, Guidotti, D., Xueping Guo, Jing Zhou, Liqiang Cao, Daquan Yu, Lixi Wan

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  13. 153
    Mechanical and electronic analysis of 3D embedded capacitor filling with conductive adhesive

    Mechanical and electronic analysis of 3D embedded capacitor filling with conductive adhesive by Huijuan Wang, Daquan Yu, Ran He, Fengwei Dai, Liqiang Cao, Lixi Wan

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  14. 154
    Simulation analysis for interfacial failure of a poymer sealed MEMS device

    Simulation analysis for interfacial failure of a poymer sealed MEMS device by Jing Zhou, Lixi Wan, Fengwei Dai, Xiangmeng Jing, Chongshen Song, Guidotti, D., Liqiang Cao, Daquan Yu

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  15. 155
    Accurate electrical simulation and design optimization for silicon interposer considering the MOS effect and eddy currents in the silicon substrate

    Accurate electrical simulation and design optimization for silicon interposer considering the MOS effect and eddy currents in the silicon substrate by Jing Zhou, Lixi Wan, Fengwei Dai, Huijuan Wang, Chongshen Song, Tianmin Du, Yanbiao Chu, Maoyun Pan, Guidotti, D., Liqiang Cao, Daquan Yu

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  16. 156
    Design of test structures for electrical and reliability measurements in a 2.5D TSV interposer

    Design of test structures for electrical and reliability measurements in a 2.5D TSV interposer by Huijuan Wang, Jing Zhou, Chongshen Song, Daquan Yu, Fengwei Dai, Guidotti, Daniel, Yang Song, Pan Jie, Qiu Delong, He Huimin, Wu Peng, Tianmin Du, Liqiang Cao, Lixi Wan

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  17. 157
    The role of Ni buffer layer between InSn solder and Cu metallization for hermetic wafer bonding

    The role of Ni buffer layer between InSn solder and Cu metallization for hermetic wafer bonding by Daquan Yu, Chengkuo Lee, Lau, J.H.

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  18. 158
    Newly developed integration method for biomedical implants using flexible polymer cable

    Newly developed integration method for biomedical implants using flexible polymer cable by Yu Daquan, Cheng Ming-Yuan, Lim Li Shiah, Myo Paing, Yu Aibin

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  19. 159
    Development of Embedded Glass Wafer Fan-Out Package With 2D Antenna Arrays for 77GHz Millimeter-wave Chip

    Development of Embedded Glass Wafer Fan-Out Package With 2D Antenna Arrays for 77GHz Millimeter-wave Chip by Yu, Tian, Zhang, Xiaodong, Chen, Li, Ren, Xiaoli, Duan, Zongming, Yu, Daquan

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  20. 160
    Heat dissipation design for a high density-high power chip package

    Heat dissipation design for a high density-high power chip package by Jing Zhou, Liqiang Cao, Xueping Guo, Qidong Wang, Guidotti, D., Xiangmeng Jing, Daquan Yu, Lixi Wan

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