Search Results - David Whalley

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  1. 161
    Ease: an environment for architecture study and experimentation

    Ease: an environment for architecture study and experimentation by Davidson, Jack W, Whalley, David B

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  2. 162
    THERMAL DESIGN OF HIGH POWER SEMICONDUCTOR PACKAGES FOR AIRCRAFT SYSTEMS

    THERMAL DESIGN OF HIGH POWER SEMICONDUCTOR PACKAGES FOR AIRCRAFT SYSTEMS by SARVAR, FARHAD, WHALLEY, DAVID C.

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  3. 163
    A simplified model of the reflow soldering process

    A simplified model of the reflow soldering process by David Whalley

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  4. 164
    Reflow soldering process simulation: a simplified model

    Reflow soldering process simulation: a simplified model by David Whalley

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  5. 165
    Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologies

    Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologies by Yan Zhang, Changqing Liu, David Whalley

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  6. 166
    Creep damage study at powercycling of lead-free surface mount device

    Creep damage study at powercycling of lead-free surface mount device by Pradeep Hegde, David Whalley, Vadim Silberschmidt

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  7. 167
    Timing constraint specification and analysis

    Timing constraint specification and analysis by Ko, Lo, Al-Yaqoubi, Nagham, Healy, Christopher, Ratliff, Emily, Arnold, Robert, Whalley, David, Harmon, Marion

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  8. 168
    Addressing instruction fetch bottlenecks by using an instruction register file

    Addressing instruction fetch bottlenecks by using an instruction register file by HINES, Stephen, TYSON, Gary, WHALLEY, David

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  9. 169
    Enhancing the effectiveness of utilizing an instruction register file

    Enhancing the effectiveness of utilizing an instruction register file by Whalley, D., Tyson, G.

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  10. 170
    Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints

    Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints by Pradeep Hegde, David Whalley, Vadim Silberschmidt

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  11. 171
    3D study of thermal stresses in lead-free surface mount devices

    3D study of thermal stresses in lead-free surface mount devices by Pradeep Hegde, David Whalley, Vadim Silberschmidt

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  12. 172
    Thermal and electrical modelling of polymer cored BGA interconnects

    Thermal and electrical modelling of polymer cored BGA interconnects by David Whalley, H. Kristiansen, F. Guillen Marin

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  13. 173
    Mechanical characterization of individual Ni/Au coated microsize polymer particles

    Mechanical characterization of individual Ni/Au coated microsize polymer particles by Guangbin Dou, David Whalley, Changqing Liu

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  14. 174
    Mechanical Performance of Polymer Cored BGA Interconnects

    Mechanical Performance of Polymer Cored BGA Interconnects by Marin, F.G., Whalley, D., Kristiansen, H., Zhang, Z.

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  15. 175
    Improving data access efficiency by using a tagless access buffer (TAB)

    Improving data access efficiency by using a tagless access buffer (TAB) by Bardizbanyan, Alen, Gavin, Peter, Whalley, David, Sjalander, Magnus, Larsson-Edefors, Per, McKee, Sally, Stenstrom, Per

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  16. 176
    The effect of droplet ejection frequency on inkjet-etched micro via holes

    The effect of droplet ejection frequency on inkjet-etched micro via holes by Yan Zhang, Changqing Liu, Whalley, D

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  17. 177
    Size and microstructure effects on the stress-strain behaviour of lead-free solder joints

    Size and microstructure effects on the stress-strain behaviour of lead-free solder joints by Hegde, P., Whalley, D.C., Silberschmidt, V.V.

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  18. 178
    Mechanical and Electrical Characterisation of Individual ACA Conductor Particles

    Mechanical and Electrical Characterisation of Individual ACA Conductor Particles by Dou, Guangbin, Whalley, David, Liu, Changqing

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  19. 179
    Fast context switches: compiler and architectural support for preemptive scheduling

    Fast context switches: compiler and architectural support for preemptive scheduling by Snyder, Jeffrey S., Whalley, David B., Baker, Theodore P.

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  20. 180
    Electronic waste management: design, analysis and application

    Electronic waste management: design, analysis and application by Whalley, David

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