Search Results - DeProspo, Bartlet H.

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  1. 1
    Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study

    Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study by Liu, Fuhan, Zhang, Rui, Khurana, Gaurav, Deprospo, Bartlet H., Tummala, Rao R., Swaminathan, Madhavan

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  2. 2
    Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics

    Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics by Liu, Fuhan, Zhang, Rui, DeProspo, Bartlet H., Dwarakanath, Shreya, Nimbalkar, Pratik, Ravichandran, Siddharth, Weyers, David, Kathaperumal, Mohanalingam, Tummala, Rao R., Swaminathan, Madhavan

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  3. 3
    Innovative Sub-5- \mu m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects

    Innovative Sub-5- \mu m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects by Liu, Fuhan, Khurana, Gaurav, Zhang, Rui, Watanabe, Atom, DeProspo, Bartlet H., Nair, Chandrasekharan, Tummala, Rao R., Swaminathan, Madhavan

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  4. 4
    Low-Cost 1- \mu m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL

    Low-Cost 1- \mu m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL by Fuhan Liu, Nair, Chandrasekharan, Ito, Hirokazu, DeProspo, Bartlet H., Ravichandran, Siddharth, Akimaru, Hisanori, Hasegawa, Koichi, Tummala, Rao R.

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  5. 5
    Low-Cost 1-[Formula Omitted]m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL

    Low-Cost 1-[Formula Omitted]m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL by Liu, Fuhan, Nair, Chandrasekharan, Ito, Hirokazu, DeProspo, Bartlet H, Ravichandran, Siddharth, Akimaru, Hisanori, Hasegawa, Koichi, Tummala, Rao R

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  6. 6
    Innovative Sub-5-[Formula Omitted]m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects

    Innovative Sub-5-[Formula Omitted]m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects by Liu, Fuhan, Khurana, Gaurav, Zhang, Rui, Watanabe, Atom, DeProspo, Bartlet H, Nair, Chandrasekharan, Tummala, Rao R, Swaminathan, Madhavan

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  7. 7
    Next Generation of 2-7 Micron Ultra-Small Microvias for 2.5D Panel Redistribution Layer by Using Laser and Photolithography Technologies

    Next Generation of 2-7 Micron Ultra-Small Microvias for 2.5D Panel Redistribution Layer by Using Laser and Photolithography Technologies by Liu, Fuhan, Nair, Chandrasekharan, Khurana, Gaurav, Watanabe, Atom, DeProspo, Bartlet H., Kubo, Atsushi, Lin, Cheng Ping, Makita, Toshiyuki, Watanabe, Naoki, Tummala, Rao R.

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  8. 8
    Low Cost Panel-Based 1-2 Micron RDL Technologies with Lower Resistance than Si BEOL for Large Packages

    Low Cost Panel-Based 1-2 Micron RDL Technologies with Lower Resistance than Si BEOL for Large Packages by Fuhan Liu, Ito, Hirokazu, Rui Zhang, DeProspo, Bartlet H., Benthaus, Fabian, Akimaru, Hisanori, Hasegawa, Kouichi, Sundaram, Venky, Tummala, Rao R.

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