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Search Results - Derakhshandeh, Jabber
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An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding Sysem
by
Noda, Hiroto
,
Hiro, Akito
,
Nishiguchi, Naoki
,
Derakhshandeh, Jabber
,
Slabbekoorn, John
,
Beyne, Eric
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Conference Proceedings
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Subjects
2.5 And 3D Packaging
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Bonding Strength
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Curing
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Die-To-Wafer Bonding
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Electronic Components
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Embedding
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Engineering
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Engineering, Electrical & Electronic
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High Temperature
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High-Temperature Superconductors
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Hybrid Bonding
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Hybrid Systems
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Low Temperature
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Materials Science
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Materials Science, Multidisciplinary
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Packaging
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Plasmas
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Polymers
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Science & Technology
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Spin-On Polymer Underfill
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Ieee Electronic Library (Iel) Conference Proceedings
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Ieee Xplore All Conference Series
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