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Package-Level Integration of Liquid Cooling Technology with Microchannel IHS for High Power Cooling
by
Chang, Je-Young
,
Kulkarni, Devdatta
,
Mahajan, Ravi
,
Jorgensen, Michael
,
Neal, Nick
,
Dischler, Rich
,
Dasu, Aravind
,
Ahuja, Sandeep
,
Mongia, Rajiv
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Conference Proceedings
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Cold Plates
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Cooling
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Electronic Packaging Thermal Management
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Electronic Systems
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Engineering
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Engineering, Electrical & Electronic
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Engineering, Mechanical
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Heating Systems
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Heterogeneous Package
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High Tdp
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Integrated Liquid Cooling Technology
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Liquid Cooling
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Microchannel Ihs
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Microchannels
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Performance Evaluation
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Physical Sciences
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Science & Technology
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Technology
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Thermal Resistance
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Thermodynamics
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Ieee Electronic Library (Iel) Conference Proceedings
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