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Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing
by
Stine, B.E.
,
Ouma, D.O.
,
Divecha, R.R.
,
Boning, D.S.
,
Chung, J.E.
,
Hetherington, D.L.
,
Harwoo, C.R.
,
Nakagawa, O.S.
,
Soo-Young Oh
Published in
IEEE transactions on semiconductor manufacturing
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Ieee Transactions On Semiconductor Manufacturing
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Applied Sciences
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Area Measurement
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Chemical Processes
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Chemical-Mechanical Polishing
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Circuit Optimization
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Circuit Testing
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Density Measurement
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Dielectric Measurements
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Electronics
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Engineering
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Engineering, Electrical & Electronic
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Engineering, Manufacturing
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Exact Sciences And Technology
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Integrated Circuit Interconnections
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Interconnect
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Microelectronic Fabrication
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Pattern Analysis
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Pattern Dependencies
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