Search Results - Doo-Wool Jang

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    Analysis of electromigration for Cu pillar bump in flip chip package

    Analysis of electromigration for Cu pillar bump in flip chip package by Jae-Hyouk Yoo, In-Soo Kang, Gi-Jo Jung, Sungdong Kim, Hyo-Sok Ahn, Won-Ho Choi, Ki-Sung Jun, Doo-Wool Jang, In-Hong Baek, Joo-Nam Yu

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    Conference Proceeding
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