Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package by Zhang, X., Chai, T.C., Lau, J.H., Selvanayagam, C.S., Biswas, K., Shiguo Liu, Pinjala, D., Tang, G.Y., Ong, Y.Y., Vempati, S.R., Wai, E., Li, H.Y., Liao, E.B., Ranganathan, N., Kripesh, V., Jiangyan Sun, Doricko, J., Vath, C.J.

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