Search Results - Dosseul, F.

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  1. 1
    Electromigration failure mechanisms for different flip chip bump configurations

    Electromigration failure mechanisms for different flip chip bump configurations by Labie, R, Webers, T, Winters, C, Cherman, V, Croes, K, Vandevelde, B, Dosseul, F

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  2. 2
    3-D finite elements simulation of drop test reliability on a Chip Scale Package: Focus on the component architecture and materials

    3-D finite elements simulation of drop test reliability on a Chip Scale Package: Focus on the component architecture and materials by Belhenini, S., Bouchou, A., Dosseul, F., Tougui, A.

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  3. 3
    Outperformance of Cu pillar flip chip bumps in electromigration testing

    Outperformance of Cu pillar flip chip bumps in electromigration testing by Labie, R., Dosseul, F., Webers, T., Winters, C., Cherman, V., Beyne, E., Vandevelde, B.

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  4. 4
    Full integration of a 3D demonstrator with TSV first interposer, ultra thin die stacking and wafer level packaging

    Full integration of a 3D demonstrator with TSV first interposer, ultra thin die stacking and wafer level packaging by Pares, G., Karoui, C., Zaid, A., Dosseul, F., Feron, M., Attard, A., Klug, G., Luesebrink, H., Martinschitz, K., Launay, N., Belhenini, S., Simon, G.

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  5. 5
    Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies

    Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies by Vandevelde, B, Labie, R, Cherman, V, Webers, T, Winters, C, Beyne, E, Dosseul, F

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  6. 6
    Magnetotransport and magnetism in single-crystal PrBa 2 Cu 3 O 7 − δ

    Magnetotransport and magnetism in single-crystal PrBa 2 Cu 3 O 7 − δ by Browning, V. M., Osofsky, M. S., Byers, J. M., Ehrlich, A. C., Dosseul, F.

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  7. 7
    Magnetotransport and magnetism in single-crystal PrBa2Cu3O7- delta

    Magnetotransport and magnetism in single-crystal PrBa2Cu3O7- delta by Browning, VM, Osofsky, MS, Byers, JM, Ehrlich, AC, Dosseul, F

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