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Search Results - Drijbooms, Christel
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Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling
by
Gupta, Anshul
,
Pedreira, Olalla Varela
,
Arutchelvan, Goutham
,
Zahedmanesh, Houman
,
Devriendt, Katia
,
Mertens, Hans
,
Tao, Zheng
,
Ritzenthaler, Romain
,
Wang, Shouhua
,
Radisic, Dunja
,
Kenis, Karine
,
Teugels, Lieve
,
Sebai, Farid
,
Lorant, Christophe
,
Jourdan, Nicolas
,
Chan, Boon Teik
,
Subramanian, Sujith
,
Schleicher, Filip
,
Hopf, Toby
,
Peter, Antony Premkumar
,
Rassoul, Nouredine
,
Debruyn, Haroen
,
Demonie, Ingrid
,
Siew, Yong Kong
,
Chiarella, Thomas
,
Briggs, Basoene
,
Zhou, Xiuju
,
Rosseel, Erik
,
De Keersgieter, An
,
Capogreco, Elena
,
Litta, Eugenio Dentoni
,
Boccardi, Guillaume
,
Baudot, Sylvain
,
Mannaert, Geert
,
Bontemps, Noemie
,
Sepulveda, A.
,
Mertens, Sofie
,
Kim, Min-Soo
,
Dupuy, Emmanuel
,
Vandersmissen, Kevin
,
Paolillo, Sara
,
Yakimets, Dmitry
,
Chehab, Bilal
,
Favia, Paola
,
Drijbooms, Christel
,
Cousserier, Joris
,
Jaysankar, Manoj
,
Lazzarino, Frederic
,
Morin, Pierre
,
Altamirano, Efrain
,
Mitard, Jerome
,
Wilson, Christopher J.
,
Holsteyns, Frank
,
Boemmels, Juergen
,
Demuynck, Steven
,
Tokei, Zsolt
,
Horiguchi, Naoto
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IEEE transactions on electron devices
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The Bottom-Up Copper Fill of Ø5µm × 40µm Vias Using 2-Component Model Chemistry
by
Radisic, Aleksandar
,
Yang, Liu
,
Drijbooms, Christel
,
Bender, Hugo
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ECS transactions
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TSV Cu Plating and Implications for CMP
by
Radisic, Aleksandar
,
Philipsen, Harold
,
Honore, Mia
,
Wang, Yu-Shuen
,
Heylen, Nancy
,
El-Mekki, Zaid
,
Armini, Silvia
,
Vandersmissen, Kevin
,
Rodet, Simon
,
Van Ammel, Annemie
,
Bender, Hugo
,
Drijbooms, Christel
,
Vanstreels, Kris
,
Ruythooren, Wouter
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