Microstructure and reliability of copper interconnects by Changsup Ryu, Kee-Won Kwon, Loke, A.L.S., Haebum Lee, Nogami, T., Dubin, V.M., Kavari, R.A., Ray, G.W., Wong, S.S.

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Copper Plated Through-Holes for 3D Electro-Thermal Systems by Taushanoff, Stefanie, Dubin, Val M, Wallace, Andrea, Mantooth, H. Alan

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Selective Plating on Flexible Glass and Polymer Substrates with Laser-Drilled Holes by Dubin, Val M, Norelli, Kevin M, Plassmeyer, Paul N

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Electrochemical materials and processes in Si integrated circuit technology by Dubin, V.M., Akolkar, R., Cheng, C.C., Chebiam, R., Fajardo, A., Gstrein, F.

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Electroless Ni-P deposition on silicon with Pd activation by DUBIN, V. M

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In situ luminescence and IR study of porous silicon during and after anodic oxidation by Dubin, V.M., Ozanam, F., Chazalviel, J.-N.

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Electromigration of submicron Damascene copper interconnects by Changsup Ryu, Kee-Won Kwon, Loke, A.L.S., Dubin, V.M., Kavari, R.A., Ray, G.W., Wong, S.S.

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Selective electroless Ni deposition onto Pd-activated Si for integrated circuit fabrication by Dubin, V.M., Lopatin, S.D., Sokolov, V.G.

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In situ infrared spectroscopic study of luminescent porous silicon by Dubin, V.M., Ozanam, F., Chazalviel, J.-N.

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Selective electroless Ni deposition on a TiW underlayer for integrated circuit fabrication by Dubin, V.M., Lopatin, S.D., Sokolov, V.G.

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Engineering gap fill, microstructure and film composition of electroplated copper for on-chip metallization by Dubin, V.M., Thomas, C.D., Baxter, N., Block, C., Chikarmane, V., McGregor, P., Jentz, D., Hong, K., Hearne, S., Zhi, C., Zierath, D., Miner, B., Kuhn, M., Budrevich, A., Simka, H., Shankar, S.

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In situ photoluminescence and photomodulated infrared study of porous silicon during etching and in ambient by Durin, V.M., Chazalviel, J.-N., Ozanam, F.

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