Search Results - Duffalo, J.M.

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  1. 1
    Novel failure modes with overmolded printed circuit board-based surface mount packages

    Novel failure modes with overmolded printed circuit board-based surface mount packages by Duffalo, J.M., Erhart, D.L., Schmok, S.C.

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    Evaluation of a plastic encapsulated package using a scalable thermal mechanical test chip

    Evaluation of a plastic encapsulated package using a scalable thermal mechanical test chip by Hullinger, A.K., Duffalo, J.M., Niederkorn, A.J., Wecker, N.J.

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    A scalable thermal mechanical test chip for package characterization and qualifications

    A scalable thermal mechanical test chip for package characterization and qualifications by Duffalo, J.M., Domer, S.M., Hollstein, R.L., Hullinger, A.K., Niederkorn, A.J., Wecker, N.J.

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