Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology by Simon, Andrew, van der Straten, Oscar, Lanzillo, Nicholas A., Yang, Chih-Chao, Nogami, Takeshi, Edelstein, Daniel C.

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Structural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects by Lanzillo, Nicholas A., Clevenger, Lawrence, Robison, Robert R., Edelstein, Daniel C.

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Sequential Lateral Solidification of Silicon Thin Films on Cu BEOL-Integrated Wafers for Monolithic 3-D Integration by Carta, Fabio, Gates, Stephen M., Limanov, Alexander B., Im, James S., Edelstein, Daniel C., Kymissis, Ioannis

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Sequential lateral solidification of silicon thin films on low-k dielectrics for low temperature integration by Carta, Fabio, Gates, Stephen M., Limanov, Alexander B., Hlaing, Htay, Im, James S., Edelstein, Daniel C., Kymissis, Ioannis

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Reliability and resistance projections for rhodium and iridium interconnects from first-principles by Lanzillo, Nicholas A., Edelstein, Daniel C.

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20 Years of Cu BEOL in manufacturing, and its future prospects by Edelstein, Daniel C.

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Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrates by Burghartz, J.N., Edelstein, D.C., Jenkiin, K.A., Kwark, Y.H.

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Post porosity plasma protection integration at 48 nm pitch by Huai Huang, Lionti, Krystelle, Volksen, Willi, Spooner, Terry, Shobha, Hosadurga, Joe Lee, Chen, James Hsueh-Chung, Magbitang, Teddie, Peethala, Brown, Liniger, Eric G., Chao Kun Hu, Huang, Elbert, Canaperi, Donald F., Standaert, Theodorus E., Edelstein, Daniel C., Grill, Alfred, Dubois, Geraud, Bonilla, Griselda

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VLSI on-chip interconnection performance simulations and measurements by Edelstein, D. C., Sai-Halasz, G. A., Mii, Y.-J.

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Optimization of silicon technology for the IBM System z9: IBM System z9 by POINDEXTER, D. J, STIFFLER, S. R, EDELSTEIN, D. C, KHARE, M, BRONNER, G. B, NAM, H.-J, BUTT, S. A, WU, P. T, AGNELLO, P. D, IVERS, T, NARASIMHA, S, FAURE, T. B, RANKIN, J. H, GROSCH, D. A, KNOX, M. D

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Engineering the extendibility of Cu/low-k BEOL technology by Edelstein, D. C.

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Advanced Cu/Low-k BEOL Integration, Reliability, and Extendibility by Edelstein, D.C.

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On-chip wiring design challenges for Gigahertz operation: Interconnections-Addressing the Next Challenge of IC Technology. Part I: Integration and Packaging Trends by DEUTSCH, Alina, COTEUS, Paul W, KOPCSAY, Gerard V, SMITH, Howard H, SUROVIC, Christopher W, KRAUTER, Byron L, EDELSTEIN, Daniel C, RESTLE, Phillip J

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Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver by Patel, C.S., Tsang, C.K., Schuster, C., Doany, F.E., Nyikal, H., Baks, C.W., Budd, R., Buchwalter, L.P., Andry, P.S., Canaperi, D.F., Edelstein, D.C., Horton, R., Knickerbocker, J.U., Krywanczyk, T., Kwark, Y.H., Kwietniak, K.T., Magerlein, J.H., Rosner, J., Sprogis, E.

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Assessment of Capacity in an Aging Society by Moye, Jennifer, Marson, Daniel C, Edelstein, Barry

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Tenofovir alafenamide versus tenofovir disoproxil fumarate, coformulated with elvitegravir, cobicistat, and emtricitabine, for initial treatment of HIV-1 infection: two randomised,... by Sax, Paul E, Dr Prof, Wohl, David, MD, Yin, Michael T, Prof, Post, Frank, MD, DeJesus, Edwin, MD, Saag, Michael, MD, Pozniak, Anton, MD, Thompson, Melanie, MD, Podzamczer, Daniel, MD, Molina, Jean Michel, Prof, Oka, Shinichi, MD, Koenig, Ellen, MD, Trottier, Benoit, MD, Andrade-Villanueva, Jaime, MD, Crofoot, Gordon, MD, Custodio, Joseph M, PharmD, Plummer, Andrew, MS, Zhong, Lijie, PhD, Cao, Huyen, MD, Martin, Hal, MD, Callebaut, Christian, PhD, Cheng, Andrew K, MD, Fordyce, Marshall W, MD, McCallister, Scott, MD

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Potential for Pet Animals to Harbour Methicillin-Resistant Staphylococcus aureus When Residing with Human MRSA Patients by Morris, D. O., Lautenbach, E., Zaoutis, T., Leckerman, K., Edelstein, P. H., Rankin, S. C.

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Decreasing Intracellular Superoxide Corrects Defective Ischemia-induced New Vessel Formation in Diabetic Mice by Ceradini, Daniel J., Yao, Dachun, Grogan, Raymon H., Callaghan, Matthew J., Edelstein, Diane, Brownlee, Michael, Gurtner, Geoffrey C.

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Prevalence of macrolide and fluoroquinolone resistance-mediating mutations in Mycoplasma genitalium in five cities in Russia and Estonia by Shipitsyna, Elena, Rumyantseva, Tatiana, Golparian, Daniel, Khayrullina, Guzel, Lagos, Amaya C, Edelstein, Inna, Joers, Kai, Jensen, Jörgen S, Savicheva, Alevtina, Rudneva, Natalia, Sukhanova, Larisa, Kozlov, Roman, Guschin, Alexander, Unemo, Magnus

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The consequences of increased 4E-BP1 in polycystic kidney disease by Holditch, Sara J, Brown, Carolyn N, Atwood, Daniel J, Pokhrel, Deepak, Brown, Sara E, Lombardi, Andrew M, Nguyen, Khoa N, Hill, Ryan C, Lanaspa, Miguel, Hopp, Katharina, Weiser-Evans, Mary C M, Edelstein, Charles L

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