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Impact of reliability tests on the adhesion of the epoxy mold compound
by
Guillon, David
,
Avots, Andris
,
Maleki, Milad
,
Schlegel, Katrin
,
Ehrler, Isabell
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Conference Proceedings
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Accelerated Tests
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Adhesion Strength
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Adhesives
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Button Shear
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Component Reliability
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Compounds
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Electric Components
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Electronic Components
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Engineering
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Engineering, Electrical & Electronic
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Epoxy Molding Compound
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Failure Mode
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Humidity
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Laser Ablation
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Materials Reliability
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Modules
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Multichip Modules
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Science & Technology
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Spiral Flow
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Spirals
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Ieee Electronic Library (Iel) Conference Proceedings
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