(Invited) Selective Atomic Layer Deposition of Cobalt for Back End of Line by Elko-Hansen, Tyler D.-M., Ekerdt, John Gilbert

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Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing by Sell, B., An, S., Armstrong, J., Bahr, D., Bains, B., Bambery, R., Bang, K., Basu, D., Bendapudi, S., Bergstrom, D., Bhandavat, R., Bhowmick, S., Buehler, M., Caselli, D., Cekli, S., Chaganti, Vrsk, Chang, Y. J., Chikkadi, K., Chu, T., Crimmins, T., Darby, G., Ege, C., Elfick, P., Elko-Hansen, T., Fang, S., Gaddam, C., Ghoneim, M., Gomez, H., Govindaraju, S., Guo, Z., Hafez, W., Haran, M., Hattendorf, M., Hu, S., Jain, A., Jaloviar, S., Jang, M., Kameswaran, J., Kapinus, V., Kennedy, A., Klopcic, S., Krishnan, D., Leib, J., Lin, Y.-T., Lindert, N., Liu, G., Loh, O., Luo, Y., Mani, S., Mleczko, M., Mocherla, S., Packan, P., Paik, M., Paliwal, A., Pandey, R., Patankar, K., Pipes, L., Plekhanov, P., Prasad, C., Prince, M., Ramalingam, G., Ramaswamy, R., Riley, J., Perez, J. R. Sanchez, Sandford, J., Sathe, A., Shah, F., Shim, H., Subramanian, S., Tandon, S., Tanniru, M., Thakurta, D., Troeger, T., Wang, X., Ward, C., Welsh, A., Wickramaratne, S., Wnuk, J., Xu, S. Q., Yashar, P., Yaung, J., Yoon, K., Young, N.

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An Intel 3 Advanced FinFET Platform Technology for High Performance Computing and SOC Product Applications by Hafez, W., Abdelkader, M., An, S., Auth, C., Bahr, D., Bambery, R., Beck, M., Bhowmick, S., Biggs-houck, J., Caselli, D., Chang, H.-Y., Chang, Y., Chauhan, S., Chikkadi, K., Chu, T., Connor, C., Diana, D., Dong, Y., Elfick, P., Elko-hansen, T., Gala, D., Geppert, C., Govindaraju, S., Grimm, W., Grunes, H., Guler, L., Guo, Z., Gupta, A., Havelia, S., Hazra, J., Islam, A., Jain, A., Jamil, M., Jang, M., Kabir, M., Kameswaran, J., Karl, E., Kelgeri, S., Kennedy, A., Kim, J., Kim, Y., Krishnan, D., Lee, G., Lee, H.-P., Lin, H., Luk, A., Luo, Y., Macfarlane, P., Mamun, A., Marla, K., Mckenna, E., Miah, A., Mistry, K., Mleczko, M., Moon, S., Nardi, D., Natarajan, S., Nolph, C., Nugroho, C., Nyhus, P., Oni, A., Packan, P., Paliwal, A., Pandey, R., Paredes, I., Park, K., Paulson, L., Pierre, A., Plekhanov, P., Prasad, C., Ramaswamy, R., Rode, J., Russell, R., Ryu, S., Saavedra, H., Salisbury, T., Sandford, J., Shah, F., Shang, K., Shekhar, P., Shu, A., Skoug, E., Sohn, J., Song, J., Sprinkle, M., Su, J., Tsao, R., Vaidya, A., Wallace, C., Wang, X., Wang, H., Ward, C., Wickramaratne, S., Wills, M., Wu, T., Xia-hua, Z., Xu, S., Yaung, J., Yu, Y., Zilm, M.

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XPS Investigation of the Atomic Layer Deposition Half Reactions of Bis(N-tert-butyl-N′-ethylpropionamidinato) Cobalt(II) by Elko-Hansen, Tyler D.-M, Ekerdt, John G

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Atomic Interdiffusion and Diffusive Stabilization of Cobalt by Copper During Atomic Layer Deposition from Bis(N-tert-butyl‑N′‑ethylpropionamidinato) Cobalt(II) by Elko-Hansen, Tyler D.-M, Dolocan, Andrei, Ekerdt, John G

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Enhanced Nucleation of Pt Particles on Boron-Treated Highly Oriented Pyrolytic Graphite via Chemical Vapor Deposition by Elko-Hansen, Tyler D. M, McCrate, Joseph M, Ekerdt, John G

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