Low temperature chemical vapor deposition of tungsten carbide for copper diffusion barriers by Sun, Y.-M, Lee, S.Y, Lemonds, A.M, Engbrecht, E.R, Veldman, S, Lozano, J, White, J.M, Ekerdt, J.G, Emesh, I, Pfeifer, K

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Oxidative coupling of methane over the oxides of Group IIIA, IVA, and VA metals by Emesh, I. T. Ali, Amenomiya, Y

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Plasma-enhanced chemical vapor deposition of silicon dioxide using tetraethylorthosilicate (TEOS) by EMESH, I. T, D'ASTI, G, MERCIER, J. S, PAK LEUNG

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Growth, selectivity and adhesion of CVD-deposited copper from Cu +1 (hexafluoroacetylacetonate trimethylvinylsilane) and dichlorodimethylsilane by Webb, James B., Northcott, Daniel, Emesh, Ismail

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Growth, selectivity and adhesion of CVD-deposited copper from Cu exp +1 (hexafluoroacetylacetonate trimethylvinylsilane) and dichlorodimethylsilane by Webb, J B, Northcott, D, Emesh, I

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Optimized integrated copper gap-fill approaches for 2x flash devices by Ma, P., Qian Luo, Sundarrajan, A., Jiang Lu, Aubuchon, J., Tseng, J., Kumar, N., Okazaki, M., Yuchun Wang, You Wang, Yufei Chen, Naik, M., Emesh, I., Narasimhan, M.

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A sub-micron BiCMOS technology for telecommunications by Hadaway, R., Kempf, P., Schvan, P., Rowlandson, M., Ho, V., Kolk, J., Tait, B., Sutherland, D., Jolly, G., Emesh, I.

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Thickness measurement for Cu and Ta thin films using optoacoustics by Gostein, M., Bailey, T.C., Emesh, I., Diebold, A.C., Maznev, A.A., Banet, M., Joffe, M., Sacco, R.

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The effect of a high-polyphenol Mediterranean diet (Green-MED) combined with physical activity on age-related brain atrophy: the Dietary Intervention Randomized Controlled Trial Po... by Kaplan, Alon, Zelicha, Hila, Yaskolka Meir, Anat, Rinott, Ehud, Tsaban, Gal, Levakov, Gidon, Prager, Ofer, Salti, Moti, Yovell, Yoram, Ofer, Jonathan, Huhn, Sebastian, Beyer, Frauke, Witte, Veronica, Villringer, Arno, Meiran, Nachshon, B Emesh, Tamar, Kovacs, Peter, von Bergen, Martin, Ceglarek, Uta, Blüher, Matthias, Stumvoll, Michael, Hu, Frank B, Stampfer, Meir J, Friedman, Alon, Shelef, Ilan, Avidan, Galia, Shai, Iris

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Retest Reliability of Integrated Speed–Accuracy Measures by Bakun Emesh, Tamar, Garbi, Dror, Kaplan, Alon, Zelicha, Hila, Yaskolka Meir, Anat, Tsaban, Gal, Rinott, Ehud, Meiran, Nachshon

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Attention control in the peripartum period: a longitudinal study by Emesh, Tamar Bakun, Meiran, Nachshon, Ran-Peled, Dar, Ben-Zion, Hamutal, Horwitz, Avel, Finkelstein, Omer, Tikotzky, Liat

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Surface chemistry and fundamental limitations on the plasma cleaning of metals by Dong, Bin, Driver, M. Sky, Emesh, Ismail, Shaviv, Roey, Kelber, Jeffry A.

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AML-194: Mast Cell Sarcoma in a Post-Remission AML Patient: Case Report and Review of Literature by Elbogdady, Mohamed, Taalab, Mona, A.F.Zaki, Marwa, Atef, Basma, Talaat, Ahmed, Emesh, Atef, Elazab, Ahmed, Dheim, Safaa, Elshamy, Alaa, Elbogdady, Aya

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Effects of Interdomain Tether Length and Flexibility on the Kinetics of Intramolecular Electron Transfer in Human Sulfite Oxidase by Johnson-Winters, Kayunta, Nordstrom, Anna R, Emesh, Safia, Astashkin, Andrei V, Rajapakshe, Asha, Berry, Robert E, Tollin, Gordon, Enemark, John H

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Intramolecular Electron Transfer in Sulfite-Oxidizing Enzymes: Elucidating the Role of a Conserved Active Site Arginine by Emesh, Safia, Rapson, Trevor D, Rajapakshe, Asha, Kappler, Ulrike, Bernhardt, Paul V, Tollin, Gordon, Enemark, John H

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Characterization of Chloride-Depleted Human Sulfite Oxidase by Electron Paramagnetic Resonance Spectroscopy: Experimental Evidence for the Role of Anions in Product Release by Rajapakshe, Asha, Johnson-Winters, Kayunta, Nordstrom, Anna R, Meyers, Kimberly T, Emesh, Safia, Astashkin, Andrei V, Enemark, John H

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Characterization of chloride-depleted human sulfite oxidase by EPR spectroscopy: experimental evidence for the role of anions in product release by Rajapakshe, Asha, Johnson-Winters, Kayunta, Nordstrom, Anna R., Meyers, Kimberly T., Emesh, Safia, Astashkin, Andrei V., Enemark, John H.

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Effects of Interdomain-Tether Length and Flexibility on the Kinetics of Intramolecular Electron Transfer in Human Sulfite Oxidas by Johnson-Winters, Kayunta, Nordstrom, Anna R., Emesh, Safia, Astashkin, Andrei V., Rajapakshe, Asha, Berry, Robert, Tollin, Gordon, Enemark, John H.

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Electrochemical Mechanical Planarization (eCMP) of Copper Thin Films by Aksu, Serdar, Emesh, Ismail, Uzoh, Cyprian, Basol, Bulent

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