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    SiC Power Module Packaging Using Printed Electronics Materials and Processes

    SiC Power Module Packaging Using Printed Electronics Materials and Processes by Al-Haidari, Riadh, Richmond, Dylan, Obeidat, Abdullah, Alhendi, Mohammed, Abbara, El Mehdi, Somarathna, Udara S., Poliks, Mark, Gowda, Arun V., Erlbaum, Jeff, Xiong, Han, Hitchcock, Collin

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    Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing

    Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing by Al-Haidari, Riadh, Alhendi, Mohammed, Richmond, Dylan, Abbara, El Mehdi, Obeidat, Abdullah, Somarathna, Udara S., Schadt, Mark, Poliks, Mark, Gowda, Arun V., Erlbaum, Jeff, Xiong, Han, Hitchcock, Collin

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