Coupled simulation to determine the impact of across wafer variations in oxide PECVD on electrical and reliability parameters of through-silicon vias by Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Minixhofer, R., Filipovic, L., de Orio, R.L., Selberherr, S.

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Large area manufacturing of plasmonic colour filters using substrate conformal imprint lithography by Rumler, M, Foerthner, M, Baier, L, Evanschitzky, P, Becker, M, Rommel, M, Frey, L

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Determination of the Dill parameters of thick positive resist for use in modeling applications by Roeder, G., Liu, S., Aygun, G., Evanschitzky, P., Erdmann, A., Schellenberger, M., Pfitzner, L.

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Challenges and opportunities for process modeling in the nanotechnology era by Lorenz, J. K., Baer, E., Burenkov, A., Erdmann, A., Evanschitzky, P., Pichler, P.

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Lithography induced layout variations in 6-T SRAM cells by Kampen, C, Evanschitzky, P, Burenkov, A, Lorenz, J

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Mask-topography-induced phase effects and wave aberrations in optical and extreme ultraviolet lithography by Erdmann, A., Shao, F., Evanschitzky, P., Fühner, T.

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Hierarchical Simulation of Process Variations and Their Impact on Circuits and Systems: Results by Lorenz, J. K., Bar, E., Clees, T., Evanschitzky, P., Jancke, R., Kampen, C., Paschen, U., Salzig, C. P. J., Selberherr, S.

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Simultaneous simulation of systematic and stochastic process variations by Lorenz, J., Bar, E., Burenkov, A., Evanschitzky, P., Asenov, A., Wang, L., Wang, X., Brown, A. R., Millar, C., Reid, D.

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Three-dimensional simulation for the reliability and electrical performance of through-silicon vias by Filipovic, L., Rudolf, F., Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Singulani, A., Minixhofer, R., Selberherr, S.

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Coupling of equipment simulation and feature-scale profile simulation for dry-etching of polysilicon gate lines by Baer, E., Kunder, D., Evanschitzky, P., Lorenz, J.

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Mask and Wafer Topography Effects in Optical and EUV-Lithography by Erdmann, Andreas, Shao, Feng, Evanschitzky, Peter, Fühner, Tim

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Benchmark of Rigorous Methods for Electromagnetic Field Simulations by Burger, S, Zschiedrich, L, Schmidt, F, Evanschitzky, P, Erdmann, A

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Aerial image analysis for defective masks in optical lithography by Graf, T., Erdmann, A., Evanschitzky, P., Tollkuhn, B., Eggers, K., Ziebold, R., Teuber, S., Hollein, I.

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How habits, social ties, and economic switching barriers affect customer loyalty in contractual service settings by Woisetschläger, David M., Lentz, Patrick, Evanschitzky, Heiner

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Control mechanisms, management orientations, and the creativity of service employees: Symmetric and asymmetric modeling by Coelho, Filipe J., Evanschitzky, Heiner, Sousa, Carlos M.P., Olya, Hossein, Taheri, Babak

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Strategic marketing and business performance: A study in three European ‘engineering countries’ by Jaakkola, Matti, Möller, Kristian, Parvinen, Petri, Evanschitzky, Heiner, Mühlbacher, Hans

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Mood regulation, customer participation, and customer value creation in hospitality services by Taheri, Babak, Coelho, Filipe J, Sousa, Carlos M.P, Evanschitzky, Heiner

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Simulation of process variations in FinFET transistor patterning by Baer, Eberhard, Burenkov, Alex, Evanschitzky, Peter, Lorenz, Juergen

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Process informed accurate compact modelling of 14-nm FinFET variability and application to statistical 6T-SRAM simulations by Xingsheng Wang, Reid, Dave, Liping Wang, Millar, Campbell, Burenkov, Alexander, Evanschitzky, Peter, Baer, Eberhard, Lorenz, Juergen, Asenov, Asen

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Hierarchical Simulation of Process Variations and Their Impact on Circuits and Systems: Results : CHARACTERIZATION OF NANO CMOS VARIABIALITY BY SIMULATION AND MEASUREMENTS by LORENZ, Jürgen K, BÄR, Eberhard, CLEES, Tanja, EVANSCHITZKY, Peter, JANCKE, Roland, KAMPEN, Christian, PASCHEN, Uwe, SALZIG, Christian P. J, SELBERHERR, Siegfried

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