Search Results - FREAR, Darrel R

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  1. 1
    Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions

    Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions by Long, Xin, Dutta, Indranath, Sarihan, Vijay, Frear, Darrel R.

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  2. 2
    Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing

    Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing by Jang, Jin-Wook, Ramanathan, Lakshmi N., Lin, Jong-Kai, Frear, Darrel R.

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  3. 3
    Issues related to the implementation of Pb-free electronic solders in consumer electronics

    Issues related to the implementation of Pb-free electronic solders in consumer electronics by Frear, DR

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  4. 4
    Interfacial reaction of eutectic AuSi solder with Si (100) and Si (111) surfaces

    Interfacial reaction of eutectic AuSi solder with Si (100) and Si (111) surfaces by Jang, Jin-Wook, Hayes, Scott, Lin, Jong-Kai, Frear, Darrel R.

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  5. 5
    Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

    Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps by Jang, Jin-Wook, De Silva, Ananda P., Lin, Jong-Kai, Frear, Darrel R.

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  6. 6
    Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn-3.8Ag-0.7Cu and Eutectic SnPb Solders

    Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn-3.8Ag-0.7Cu and Eutectic SnPb Solders by Jin-Wook Jang, De Silva, A.P., Drye, J.E., Post, S.L., Owens, N.L., Jong-Kai Lin, Frear, D.R.

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  7. 7
    System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip

    System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip by Jones, R.E., Ramiah, C., Kamgaing, T., Banerjee, S.K., Chi-Taou Tsai, Hughes, H.G., De Silva, A.P., Drye, J., Li Li, Blood, W., Qiang Li, Vaughan, C.R., Miglore, R., Penunuri, D., Lucero, R., Frear, D.R., Miller, M.F.

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  8. 8
    Failure morphology after drop impact test of ball grid array (BGA) package with lead-free Sn-3.8Ag-0.7Cu and eutectic SnPb solders : Drop testing

    Failure morphology after drop impact test of ball grid array (BGA) package with lead-free Sn-3.8Ag-0.7Cu and eutectic SnPb solders : Drop testing by JANG, Jin-Wook, DE SILVA, Ananda P, DRYE, James E, POST, Steve L, OWENS, Norman L, LIN, Jong-Kai, FREAR, Darrel R

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  9. 9
    Integration of SAW RF Rx filter stacked on a transceiver chip in a QFN package

    Integration of SAW RF Rx filter stacked on a transceiver chip in a QFN package by Jones, R.E., Ramiah, C., Kamgaing, T., Banerjee, S.K., Chi-Taou Tsai, Hughes, H., De Silva, A., Drye, J., Vaughan, C., Miglore, R., Penunuri, D., Lucero, R., Frear, D.R., Miller, M.

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  10. 10
    Microstructural evolution during thermomechanical fatigue of 62Sn-36Pb-2Ag and 60Sn-40Pb solder joints

    Microstructural evolution during thermomechanical fatigue of 62Sn-36Pb-2Ag and 60Sn-40Pb solder joints by Frear, D.R.

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  11. 11
    Thermomechanical fatigue of solder joints: a new comprehensive test method

    Thermomechanical fatigue of solder joints: a new comprehensive test method by Frear, D.R.

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  12. 12
    Tensile behavior of Pb-Sn solder/Cu joints

    Tensile behavior of Pb-Sn solder/Cu joints by QUAN, L, FREAR, D, GRIVAS, D, MORRIS, J. W. JR

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